Produits Sullins Connector Solutions - Supports pour CI, transistors | Heisener Electronics
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Produits Sullins Connector Solutions - Supports pour CI, transistors

Dossiers 8
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Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
ASU02DXTB
Sullins Connector Solutions

CONN SOCKET AXIAL 2POS GOLD

  • Type: Axial
  • Number of Positions or Pins (Grid): 2 (Rectangular)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: -
  • Mounting Type: Through Hole
  • Features: Board Guide
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
paquet: -
Stock6 066
2 (Rectangular)
-
Gold
10µin (0.25µm)
-
Through Hole
Board Guide
Solder
-
Gold
10µin (0.25µm)
-
-
-
TMJ03DKSD-S1512
Sullins Connector Solutions

CONN TRANSIST TO-254 3POS GOLD

  • Type: Transistor, TO-254
  • Number of Positions or Pins (Grid): 3 (Rectangular)
  • Pitch - Mating: 0.150" (3.81mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Flange
  • Termination: Solder
  • Pitch - Post: 0.150" (3.81mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -50°C ~ 175°C
paquet: -
Stock8 424
3 (Rectangular)
0.150" (3.81mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Flange
Solder
0.150" (3.81mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-50°C ~ 175°C
TDU03DTON
Sullins Connector Solutions

CONN SOCKET TRANSIST 3POS GOLD

  • Type: Transistor
  • Number of Positions or Pins (Grid): 3 (Rectangular)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Board Guide
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -55°C ~ 175°C
paquet: -
Stock7 884
3 (Rectangular)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Board Guide
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-55°C ~ 175°C
FMC05DRTN-S1682
Sullins Connector Solutions

CONN TRANSIST TO-220/TO-247 5POS

  • Type: Transistor, TO-220 and TO-247
  • Number of Positions or Pins (Grid): 5 (Rectangular)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Nickel Boron
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Nickel Boron
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 200°C
paquet: -
Stock5 004
5 (Rectangular)
-
Gold
30µin (0.76µm)
Nickel Boron
Through Hole
-
Solder
-
Gold
30µin (0.76µm)
Nickel Boron
Polyphenylene Sulfide (PPS)
-65°C ~ 200°C
TCC03DKSN-S1713
Sullins Connector Solutions

CONN TRANSIST TO-262 3POS GOLD

  • Type: Transistor, TO-262
  • Number of Positions or Pins (Grid): 3 (Rectangular)
  • Pitch - Mating: 0.150" (3.81mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.150" (3.81mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -50°C ~ 175°C
paquet: -
Stock6 480
3 (Rectangular)
0.150" (3.81mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.150" (3.81mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-50°C ~ 175°C
MPP-1100-05-DS-4GR(S1402)
Sullins Connector Solutions

CONN TRANSIST TO-220/TO-247 5POS

  • Type: Transistor, TO-220 and TO-247
  • Number of Positions or Pins (Grid): 5 (Rectangular)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Nickel Boron
  • Mounting Type: Through Hole, Right Angle
  • Features: -
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Nickel Boron
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 200°C
paquet: -
Stock6 624
5 (Rectangular)
-
Gold
30µin (0.76µm)
Nickel Boron
Through Hole, Right Angle
-
Solder
-
Gold
30µin (0.76µm)
Nickel Boron
Polyphenylene Sulfide (PPS)
-65°C ~ 200°C
TCC05DCSN-S1403
Sullins Connector Solutions

CONN TRANSIST TO-220/TO-247 5POS

  • Type: Transistor, TO-220 and TO-247
  • Number of Positions or Pins (Grid): 5 (Rectangular)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 175°C
paquet: -
Stock8 334
5 (Rectangular)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 175°C
TDU03DTOD
Sullins Connector Solutions

CONN SOCKET TRANSIST 3POS GOLD

  • Type: Transistor
  • Number of Positions or Pins (Grid): 3 (Rectangular)
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Board Guide, Flange
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -55°C ~ 175°C
paquet: -
Stock6 240
3 (Rectangular)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Board Guide, Flange
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-55°C ~ 175°C