Page 181 - Maxim DS TVS DIODE | Heisener Electronics
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Maxim DS TVS DIODE

Dossiers 5 482
Page  181/183
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
DS34S101GN
Maxim Integrated

IC TRANSPORT TDM/PACKET 256CSBGA

  • Type: TDM (Time Division Multiplexing)
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA, CSBGA
  • Supplier Device Package: 256-CSBGA (17x17)
paquet: 256-BGA, CSBGA
Stock3 808
DS2411X#U
Maxim Integrated

IC SILICON SER NUMBER FLIPCHIP

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: 4-XFBGA, CSPBGA
  • Supplier Device Package: 4-FlipChip
paquet: 4-XFBGA, CSPBGA
Stock4 288
DS2411X
Maxim Integrated

IC SILICON SER NUMBER FLIPCHIP

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: 4-XFBGA, CSPBGA
  • Supplier Device Package: 4-FlipChip
paquet: 4-XFBGA, CSPBGA
Stock5 136
DS2411R+U
Maxim Integrated

IC SILICON SERIAL NUMBER SOT-23

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SOT-23-3
paquet: TO-236-3, SC-59, SOT-23-3
Stock3 296
DS2401X1#U
Maxim Integrated

IC SILICON SERIAL NUMBER 2-CSP

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: 2-UFBGA, CSPBGA
  • Supplier Device Package: 2-FlipChip
paquet: 2-UFBGA, CSPBGA
Stock5 776
DS3181N+
Maxim Integrated

IC ATM/PACKET PHY W/LIU 400BGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock4 656
hot DS3181+
Maxim Integrated

IC ATM/PACKET PHY W/LIU 400BGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock13 092
DS8102+
Maxim Integrated

IC MODULATOR/DECODER 16-TSSOP

  • Type: Modulator
  • Applications: Energy Measurement
  • Mounting Type: Surface Mount
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
paquet: 16-TSSOP (0.173", 4.40mm Width)
Stock3 312
DS3164+
Maxim Integrated

IC ATM/PACKET PHY QUAD 400-BGA

  • Type: PHY Transceiver
  • Applications: Testing Equipment
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock3 280
DS3605C+TRL
Maxim Integrated

IC CTRLR NV SRAM 3.6V 25-CSBGA

  • Type: Security Controller
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 25-TFBGA, CSPBGA
  • Supplier Device Package: 25-CSBGA (5x5)
paquet: 25-TFBGA, CSPBGA
Stock2 816
DS3182+
Maxim Integrated

IC PHY ATM/PACKET DUAL 400-TEBGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock3 744
DS3163
Maxim Integrated

IC TRPL ATM/PACKET PHY 400BGA

  • Type: PHY Transceiver
  • Applications: Testing Equipment
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock4 096
DS3163N
Maxim Integrated

IC TRPL ATM/PACKET PHY 400BGA

  • Type: PHY Transceiver
  • Applications: Testing Equipment
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock2 384
DS3183
Maxim Integrated

IC TRPL ATM/PACKET PHY 400BGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock2 416
DS3183N
Maxim Integrated

IC TRPL ATM/PACKET PHY 400BGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock6 608
DS3184
Maxim Integrated

IC QUAD ATM/PACKET PHY 400BGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock2 656
DS3164
Maxim Integrated

IC QUAD ATM/PACKET PHY 400BGA

  • Type: PHY Transceiver
  • Applications: Testing Equipment
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock7 472
DS3184N
Maxim Integrated

IC QUAD ATM/PACKET PHY 400BGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock5 328
DS3164N
Maxim Integrated

IC QUAD ATM/PACKET PHY 400BGA

  • Type: PHY Transceiver
  • Applications: Testing Equipment
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock7 680
DS3184N+
Maxim Integrated

IC PACKET PHY W/LIU 400-CSBGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock7 248
DS3184+
Maxim Integrated

IC PACKET PHY W/LIU 400-CSBGA

  • Type: Framer
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA
  • Supplier Device Package: 400-PBGA (27x27)
paquet: 400-BBGA
Stock2 128
DS2188SN/TRL
Maxim Integrated

IC ATTEN JTR T1/CEPT IND 16-SOIC

  • Type: Jitter Attenuator
  • Applications: T1/CEPT
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.295", 7.50mm Width)
Stock6 208
hot DS2188SN
Maxim Integrated

IC ATTEN JTR T1/CEPT IND 16-SOIC

  • Type: Jitter Attenuator
  • Applications: T1/CEPT
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.295", 7.50mm Width)
Stock83 868
hot DS2401X1
Maxim Integrated

IC SILICON SERIAL NUMBER 2-CSP

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: 2-UFBGA, CSPBGA
  • Supplier Device Package: 2-CSP
paquet: 2-UFBGA, CSPBGA
Stock34 032
hot DS2401P
Maxim Integrated

IC SILICON SERIAL NUMBER 6-TSOC

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: 6-LSOJ (0.148", 3.76mm Width)
  • Supplier Device Package: 6-TSOC
paquet: 6-LSOJ (0.148", 3.76mm Width)
Stock18 672
hot DS2401Z
Maxim Integrated

IC SILICON SERIAL NUMBER SOT-223

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: TO-261-4, TO-261AA
  • Supplier Device Package: SOT-223-3
paquet: TO-261-4, TO-261AA
Stock70 716
hot DS2401
Maxim Integrated

IC SILICON SERIAL NUMBER TO-92

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA)
  • Supplier Device Package: TO-92-3
paquet: TO-226-3, TO-92-3 (TO-226AA)
Stock8 544
hot DS34T104GN
Maxim Integrated

IC TDM/PACKET CHIP 484-BGA

  • Type: TDM (Time Division Multiplexing)
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-TEBGA (23x23)
paquet: 484-BGA
Stock8 076
hot DS34S108GN+
Maxim Integrated

IC TRANSPORT TDM 484BGA

  • Type: TDM (Time Division Multiplexing)
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-TEBGA (23x23)
paquet: 484-BGA
Stock5 456
hot DS34S108GN
Maxim Integrated

IC TDM/PACKET TRANSPORT

  • Type: TDM (Time Division Multiplexing)
  • Applications: Data Transport
  • Mounting Type: Surface Mount
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-TEBGA (23x23)
paquet: 484-BGA
Stock14 100