Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Frequency | Frequency Stability | Frequency Tolerance | Features | Capacitance | Impedance | Operating Temperature | Mounting Type | Package / Case | Size / Dimension | Height |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
SAW RES 314.9000MHZ SMD
|
paquet: 6-SMD |
Stock8 658 |
|
314.9MHz | ±50ppm | - | - | - | 50 Ohm | -45°C ~ 125°C | Surface Mount | 6-SMD | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 0.039" (1.00mm) |
||
Murata |
SAW RES 868.3500MHZ SMD
|
paquet: 6-SMD |
Stock2 412 |
|
868.35MHz | 0.032ppm | ±100kHz | - | - | 1 MOhm | -40°C ~ 125°C | Surface Mount | 6-SMD | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 0.054" (1.38mm) |
||
Panasonic Electronic Components |
CER RES 16.0000MHZ 8PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock8 910 |
|
16MHz | ±0.2% | ±0.5% | Built in Capacitor | 8pF | - | -20°C ~ 80°C | Surface Mount | 3-SMD, Non-Standard | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.049" (1.25mm) |
||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
SAW RES 315.0200MHZ SMD
|
paquet: 8-SMD |
Stock5 436 |
|
315.02MHz | - | - | - | - | 50 Ohm | -40°C ~ 125°C | Surface Mount | 8-SMD | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.057" (1.45mm) |
||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
SAW RES 390.0000MHZ SMD
|
paquet: 4-SMD |
Stock6 246 |
|
390MHz | - | - | - | - | 50 Ohm | -40°C ~ 125°C | Surface Mount | 4-SMD | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.057" (1.45mm) |
||
Murata |
CER RES 500.0000KHZ T/H
|
paquet: Radial, Box - 2 Lead, 2.50mm Pitch |
Stock3 294 |
|
500kHz | ±0.3% | ±2kHz | - | - | 30 Ohm | -20°C ~ 80°C | Through Hole | Radial, Box - 2 Lead, 2.50mm Pitch | 0.276" L x 0.138" W (7.00mm x 3.50mm) | 0.354" (9.00mm) |
||
Panasonic Electronic Components |
CER RES 3.5800MHZ T/H
|
paquet: Radial, Box - 3 Lead, 2.50mm Pitch |
Stock2 718 |
|
3.58MHz | ±0.3% | ±0.5% | Built in Capacitor | - | - | -20°C ~ 80°C | Through Hole | Radial, Box - 3 Lead, 2.50mm Pitch | 0.335" L x 0.158" W (8.50mm x 4.00mm) | 0.197" (5.00mm) |
||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
SAW RES SMD
|
paquet: 4-SMD |
Stock6 174 |
|
- | - | - | - | - | - | - | Surface Mount | 4-SMD | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.057" (1.45mm) |
||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
SAW RES 315.0000MHZ SMD
|
paquet: 6-SMD |
Stock7 830 |
|
315MHz | ±50ppm | - | - | - | 50 Ohm | -45°C ~ 125°C | Surface Mount | 6-SMD | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 0.039" (1.00mm) |
||
AVX Corp/Kyocera Corp |
CER RES 3.0000MHZ SMD
|
paquet: 2-SMD, Non-Standard |
Stock3 960 |
|
3MHz | ±0.3% | ±0.5% | - | - | 100 Ohm | -20°C ~ 80°C | Surface Mount | 2-SMD, Non-Standard | 0.291" L x 0.134" W (7.40mm x 3.40mm) | 0.091" (2.30mm) |
||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
SAW RES 433.9200MHZ SMD
|
paquet: 6-SMD |
Stock8 496 |
|
433.92MHz | - | - | - | - | 50 Ohm | -45°C ~ 125°C | Surface Mount | 6-SMD | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 0.043" (1.09mm) |
||
TDK Corporation |
CER RES 16.0000MHZ T/H
|
paquet: Radial - 2 Leads |
Stock2 448 |
|
16MHz | ±0.3% | ±0.5% | - | - | 40 Ohm | -40°C ~ 85°C | Through Hole | Radial - 2 Leads | 0.236" L x 0.157" W (6.00mm x 4.00mm) | 0.276" (7.00mm) |
||
AVX Corp/Kyocera Corp |
CER RES 3.6800MHZ SMD
|
paquet: 2-SMD, Non-Standard |
Stock3 546 |
|
3.68MHz | ±0.3% | ±0.5% | - | - | 30 Ohm | -20°C ~ 80°C | Surface Mount | 2-SMD, Non-Standard | 0.291" L x 0.134" W (7.40mm x 3.40mm) | 0.091" (2.30mm) |
||
ECS Inc. |
CER RES 48.0000MHZ 8PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock6 210 |
|
48MHz | ±0.3% | ±0.5% | Built in Capacitor | 8pF | - | -20°C ~ 80°C | Surface Mount | 3-SMD, Non-Standard | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.047" (1.19mm) |
||
Murata |
CER RES 12.0000MHZ 33PF SMD
|
paquet: 3-SMD, No Lead |
Stock3 708 |
|
12MHz | ±0.07% | ±0.5% | Built in Capacitor | 33pF | - | 0°C ~ 70°C | Surface Mount | 3-SMD, No Lead | 0.126" L x 0.051" W (3.20mm x 1.30mm) | 0.039" (1.00mm) |
||
AVX Corp/Kyocera Corp |
CER RES 7.3700MHZ 15PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock6 012 |
|
7.37MHz | ±0.5% | ±0.5% | Built in Capacitor | 15pF | - | -40°C ~ 125°C | Surface Mount | 3-SMD, Non-Standard | 0.177" L x 0.079" W (4.50mm x 2.00mm) | 0.047" (1.19mm) |
||
Abracon LLC |
CER RES 10.0000MHZ 15PF T/H
|
paquet: Radial - 3 Lead, Formed |
Stock2 412 |
|
10MHz | ±0.5% | ±0.3% | Built in Capacitor | 15pF | 25 Ohm | -25°C ~ 85°C | Through Hole | Radial - 3 Lead, Formed | 0.217" L x 0.118" W (5.50mm x 3.00mm) | 0.217" (5.50mm) |
||
AVX Corp/Kyocera Corp |
CER RES 5.0000MHZ 15PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock5 940 |
|
5MHz | ±0.5% | ±0.5% | Built in Capacitor | 15pF | - | -40°C ~ 125°C | Surface Mount | 3-SMD, Non-Standard | 0.177" L x 0.079" W (4.50mm x 2.00mm) | 0.047" (1.19mm) |
||
ECS Inc. |
CER RES 200.0000KHZ T/H
|
paquet: Radial, Box - 2 Lead, 10.00mm Pitch |
Stock15 804 |
|
200kHz | ±0.3% | ±1kHz | - | - | - | -20°C ~ 80°C | Through Hole | Radial, Box - 2 Lead, 10.00mm Pitch | 0.531" L x 0.150" W (13.50mm x 3.80mm) | 0.579" (14.70mm) |
||
ECS Inc. |
CER RES 3.6800MHZ 30PF T/H
|
paquet: Radial - 3 Lead, 2.50mm Pitch |
Stock20 004 |
|
3.68MHz | ±0.3% | ±0.5% | Built in Capacitor | 30pF | 30 Ohm | -20°C ~ 80°C | Through Hole | Radial - 3 Lead, 2.50mm Pitch | 0.394" L x 0.197" W (10.00mm x 5.00mm) | 0.295" (7.50mm) |
||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
SAW RES 304.3000MHZ SMD
|
paquet: 8-SMD |
Stock7 956 |
|
304.3MHz | - | - | - | - | 50 Ohm | -40°C ~ 125°C | Surface Mount | 8-SMD | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.053" (1.35mm) |
||
AVX Corp/Kyocera Corp |
CER RES 18.4300MHZ 10PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock4 806 |
|
18.43MHz | ±0.1% | ±0.5% | Built in Capacitor | 10pF | - | -40°C ~ 85°C | Surface Mount | 3-SMD, Non-Standard | 0.291" L x 0.134" W (7.40mm x 3.40mm) | 0.079" (2.00mm) |
||
Murata |
CER RESONATOR
|
paquet: 3-SMD, Non-Standard |
Stock48 432 |
|
10MHz | ±0.2% | ±0.5% | Built in Capacitor | 10pF | 40 Ohm | -40°C ~ 125°C | Surface Mount | 3-SMD, Non-Standard | 0.126" L x 0.051" W (3.20mm x 1.30mm) | 0.031" (0.79mm) |
||
Murata |
CER RES 32.0000MHZ 5PF T/H
|
paquet: Radial - 3 Lead, 2.50mm Pitch |
Stock15 612 |
|
32MHz | ±0.2% | ±0.5% | Built in Capacitor | 5pF | 50 Ohm | -20°C ~ 80°C | Through Hole | Radial - 3 Lead, 2.50mm Pitch | 0.217" L x 0.118" W (5.50mm x 3.00mm) | 0.256" (6.50mm) |
||
Abracon LLC |
CER RES 32.0000MHZ 5PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock104 226 |
|
32MHz | ±0.3% | ±0.5% | Built in Capacitor | 5pF | 40 Ohm | -25°C ~ 85°C | Surface Mount | 3-SMD, Non-Standard | 0.146" L x 0.122" W (3.70mm x 3.10mm) | 0.039" (1.00mm) |
||
Abracon LLC |
CER RES 4.0000MHZ 30PF T/H
|
paquet: Radial - 3 Lead, 2.50mm Pitch |
Stock32 064 |
|
4MHz | ±0.3% | ±0.5% | Built in Capacitor | 30pF | 30 Ohm | -25°C ~ 85°C | Through Hole | Radial - 3 Lead, 2.50mm Pitch | 0.394" L x 0.197" W (10.00mm x 5.00mm) | 0.315" (8.00mm) |
||
Murata |
CER RES 6.0000MHZ 15PF T/H
|
paquet: Radial - 3 Lead, 2.50mm Pitch |
Stock23 958 |
|
6MHz | ±0.2% | ±0.5% | Built in Capacitor | 15pF | 30 Ohm | -20°C ~ 80°C | Through Hole | Radial - 3 Lead, 2.50mm Pitch | 0.315" L x 0.118" W (8.00mm x 3.00mm) | 0.236" (6.00mm) |
||
Abracon LLC |
CER RES 20.0000MHZ 10PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock48 102 |
|
20MHz | ±0.2% | ±0.5% | Built in Capacitor | 10pF | 60 Ohm | -25°C ~ 85°C | Surface Mount | 3-SMD, Non-Standard | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.047" (1.19mm) |
||
Murata |
CER RES 6.0000MHZ 39PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock56 088 |
|
6MHz | ±0.2% | ±5% | Built in Capacitor | 39pF | 50 Ohm | -20°C ~ 80°C | Surface Mount | 3-SMD, Non-Standard | 0.177" L x 0.079" W (4.50mm x 2.00mm) | 0.047" (1.19mm) |
||
ECS Inc. |
CER RES 20.0000MHZ 15PF SMD
|
paquet: 3-SMD, Non-Standard |
Stock125 454 |
|
20MHz | ±0.3% | ±0.5% | Built in Capacitor | 15pF | - | -20°C ~ 80°C | Surface Mount | 3-SMD, Non-Standard | 0.146" L x 0.122" W (3.70mm x 3.10mm) | 0.059" (1.50mm) |