Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK FANOUT BUFFER 48VFQFPN
|
paquet: 48-VFQFN Exposed Pad |
Stock2 208 |
|
1 | 3:11 | Yes/Yes | HCSL, LVDS, LVPECL, Crystal | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | 500MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFN (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16QFN
|
paquet: 16-WFQFN Exposed Pad |
Stock7 344 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Maxim Integrated |
IC CLK BUFFER 1:15 52TQFP
|
paquet: 52-TQFP |
Stock3 328 |
|
1 | 1:15 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 1GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 52-TQFP | 52-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 250MHZ 28TSSOP
|
paquet: 28-TSSOP (0.173", 4.40mm Width) |
Stock4 176 |
|
1 | 1:5 | Yes/No | eHSTL, HSTL, LVPECL, LVTTL | eHSTL, HSTL, LVTTL | 250MHz | 2.4 V ~ 2.6 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 66MHZ 20QSOP
|
paquet: 20-SSOP (0.154", 3.90mm Width) |
Stock5 904 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 66MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 560 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 140MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUF 1:9 133.3MHZ 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock62 676 |
|
1 | 1:9 | No/No | Clock | Clock | 133.3MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 650MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock6 512 |
|
1 | 1:5 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:10 650MHZ 40VFQFPN
|
paquet: 40-VFQFN Exposed Pad |
Stock5 904 |
|
1 | 2:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 650MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 450MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock6 912 |
|
1 | 1:2 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC CLK BUFFER 1:18 250MHZ 32LQFP
|
paquet: 32-LQFP |
Stock5 584 |
|
1 | 1:18 | Yes/Yes | LVCMOS, LVPECL | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 100MHZ 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock3 344 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 66MHZ 20QSOP
|
paquet: 20-SSOP (0.154", 3.90mm Width) |
Stock2 640 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 66MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock5 472 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
paquet: 48-LQFP |
Stock6 192 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 300MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock5 056 |
|
1 | 2:4 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 300MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:8 13.4MHZ 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock2 368 |
|
1 | 2:8 | No/No | LVCMOS, Sine Wave | LVCMOS | 13.4MHz | 1.62 V ~ 1.98 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFN (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8GHZ 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock5 856 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:6 100MHZ 16SSOP
|
paquet: 16-SSOP (0.209", 5.30mm Width) |
Stock3 344 |
|
1 | 1:6 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock5 536 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock4 384 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) |
Stock3 504 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 220MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 080 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 220MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:3 150MHZ 6SOT23
|
paquet: SOT-23-6 |
Stock45 504 |
|
1 | 1:3 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM7050
|
paquet: - |
Stock3 040 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:12 200MHZ 32TQFP
|
paquet: 32-TQFP |
Stock9 660 |
|
1 | 2:12 | Yes/No | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock84 000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 3:5 3.1GHZ 32WQFN
|
paquet: 32-WFQFN Exposed Pad |
Stock19 452 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-WQFN (5x5) |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 3:11 48TQFN
|
paquet: 48-VFQFN Exposed Pad |
Stock7 792 |
|
1 | 3:11 | Yes/No | LVCMOS, LVTTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-TQFN (7x7) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock2 528 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |