Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Interrupt Output | Features | Output Type | Current - Output Source/Sink | Clock Frequency | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC IO EXPANDER 24I/O
|
paquet: 36-SOP (0.311", 7.90mm) |
Stock7 968 |
|
Parallel | No | - | CMOS, Open-Drain | - | - | 2 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 36-SOP (0.311", 7.90mm) | 36-MFPSDJ |
||
Intersil |
IC I/O EXPANDER 24B 44MQFP
|
paquet: 44-QFP |
Stock4 128 |
|
Parallel | No | - | Open Drain | 2.5mA | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Intersil |
IC I/O EXPANDER 24B 44MQFP
|
paquet: 44-QFP |
Stock7 248 |
|
Parallel | No | - | Open Drain | 2.5mA | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Maxim Integrated |
IC I/O EXPANDER I2C 16B 24TQFN
|
paquet: 24-WFQFN Exposed Pad |
Stock150 288 |
|
I2C, SMBus | Yes | POR | Push-Pull | 31mA, 43mA | 400kHz | 2 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Texas Instruments |
IC GPIO EXPANDER 16DSBGA
|
paquet: 16-WFBGA, DSBGA |
Stock4 112 |
|
MIPI? RFFE | No | POR | Open Drain | - | 26MHz | 1.8 V ~ 3.3 V | 0°C ~ 85°C | Surface Mount | 16-WFBGA, DSBGA | 16-DSBGA (2.12x2.50) |
||
NXP |
IC I/O EXPANDER I2C 16B 24HVQFN
|
paquet: 24-VFQFN Exposed Pad |
Stock4 400 |
|
I2C, SMBus | Yes | POR | Push-Pull | 10mA, 25mA | 400kHz | 2.3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) |
||
Texas Instruments |
EXPANDER REGISTERS
|
paquet: 24-SSOP (0.209", 5.30mm Width) |
Stock6 624 |
|
I2C, SMBus | Yes | POR | Push-Pull | 10mA, 25mA | 400kHz | 1.65 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Exar Corporation |
IC I/O PORT EXPANDER 8 BIT I2C G
|
paquet: - |
Stock3 952 |
|
I2C, SMBus | Yes | - | Open Drain | - | 400kHz | 1.65 V ~ 3.6 V | -40°C ~ 85°C | - | - | - |
||
Diodes Incorporated |
INTERFACE IO EXPANDER U-QFN1616-
|
paquet: - |
Stock4 896 |
|
I2C | Yes | - | - | 20mA | 1MHz | 2.3 V ~ 5.5 V | - | - | - | - |
||
Maxim Integrated |
IC I/O EXPANDER I2C 4B 16TQFN
|
paquet: 16-WFQFN Exposed Pad |
Stock4 992 |
|
I2C | Yes | POR | - | 20mA | 400kHz | 1.7 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 16-WFQFN Exposed Pad | 16-TQFN (3x3) |
||
Exar Corporation |
IC I/O EXPANDER SPI 16B 24TSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) |
Stock6 660 |
|
SPI | Yes | - | Open Drain | - | 26MHz | 1.65 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Texas Instruments |
IC I/O EXPANDR I2C 16BIT 24TSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) |
Stock6 080 |
|
I2C | Yes | POR | Push-Pull | - | 400kHz | 1.65 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC SPI GPI 8BIT 18V 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock4 864 |
|
SPI Serial | Yes | - | Push-Pull | - | 5MHz | 2.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14DIP
|
paquet: 14-DIP (0.300", 7.62mm) |
Stock5 360 |
|
CAN V2.0b | No | ADC, EEPROM, PWM | Push-Pull | 25mA | 4MHz | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28QFN
|
paquet: 28-VQFN Exposed Pad |
Stock15 156 |
|
I2C | Yes | POR | Push-Pull | 25mA | 400kHz | 2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
NXP |
IC I/O EXPANDER I2C 4B 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock9 384 |
|
I2C, SMBus | No | POR | Push-Pull | 10mA, 25mA | 400kHz | 2.3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC I/O EXPANDER I2C 8B 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock20 004 |
|
I2C | Yes | POR | Push-Pull | 300µA, 25mA | 100kHz | 2.5 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SO |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18DIP
|
paquet: 18-DIP (0.300", 7.62mm) |
Stock17 940 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Exar Corporation |
IC I/O EXPANDER SPI 8B 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock17 406 |
|
SPI | Yes | - | Open Drain | - | 26MHz | 1.65 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
IC I/O EXPANDER I2C 16B 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock18 888 |
|
I2C, SMBus | Yes | POR | Push-Pull | 10mA, 25mA | 400kHz | 2.3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
Intersil |
IC I/O EXPANDER 24B 40DIP
|
paquet: 40-DIP (0.600", 15.24mm) |
Stock35 772 |
|
Parallel | No | - | Open Drain | 2.5mA | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-DIP |
||
Maxim Integrated |
IC I/O EXPANDER I2C 16B 24TQFN
|
paquet: 24-WFQFN Exposed Pad |
Stock47 964 |
|
I2C, SMBus | Yes | PWM | Open Drain | 50mA | 400kHz | 2 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock14 916 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18SOIC
|
paquet: 18-SOIC (0.295", 7.50mm Width) |
Stock5 504 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
NXP |
IC I/O EXPANDER I2C 16B 24HVQFN
|
paquet: 24-VFQFN Exposed Pad |
Stock135 528 |
|
I2C, SMBus | Yes | POR | Push-Pull | 10mA, 25mA | 400kHz | 2.3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) |
||
NXP |
IC I/O EXPANDER I2C 4B 8TSSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4 816 |
|
I2C, SMBus | No | POR | Push-Pull | 10mA, 25mA | 400kHz | 2.3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
Microsemi Corporation |
SXP 36X12G
|
paquet: - |
Stock4 800 |
|
- | No | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC I/O EXPANDER 24B 44MQFP
|
paquet: 44-QFP |
Stock5 408 |
|
Parallel | No | - | Open Drain | 2.5mA | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Renesas Electronics America |
IC I/O EXPANDER 24B 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock7 536 |
|
Parallel | No | - | Open Drain | 2.5mA | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.58x16.58) |
||
Microchip Technology |
SXP 48X12G
|
paquet: - |
Stock4 160 |
|
- | No | - | - | - | - | - | - | - | - | - |