Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SLIC VOICE ACCESS PDSO-20
|
paquet: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Stock2 304 |
|
IOM-2, PCM | 2 | 3.3 V ~ 5 V | 105mA | - | - | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
||
Exar Corporation |
IC TI/E1/J1 FRAMER/LIU 329FBGA
|
paquet: 329-FBGA |
Stock10 152 |
|
- | 8 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 329-FBGA | 329-FPBGA (17x17) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 1CH 52TQFP
|
paquet: 52-LQFP |
Stock4 224 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 1CH 44-TQFP
|
paquet: 44-LQFP |
Stock2 720 |
|
- | - | 3.13 V ~ 3.47 V | - | - | - | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
Broadcom Limited |
INTEGRATED GBE CONTROLLER
|
paquet: - |
Stock2 736 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
1CH NG SLIC 63DB LB QFN28 4X5
|
paquet: - |
Stock5 040 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
FOUR CHANNEL COMBINED T1/E1/J1 T
|
paquet: - |
Stock2 304 |
|
E1, J1, SPI, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | - | 256-CABGA (17x17) |