Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FPGA 2M CONFIG MEM 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock6 592 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 376 |
|
16Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 432 |
|
16Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 44-VQFP
|
paquet: 44-TQFP |
Stock33 924 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock5 824 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 5V 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock4 000 |
|
400kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC 3V PROM SER 300K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 480 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 200K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock103 212 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 456 |
|
100kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC SER CFG PROM 65K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 592 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock12 468 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 256K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock2 736 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 128KB 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock3 760 |
|
128kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 416 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 192 |
|
512kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CONFIG PROM 256K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 496 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 256KB 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock50 556 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 128K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock7 888 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
1C SERIAL CONFIG PROM 2M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock3 936 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 128KB 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 048 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC 3V SER CFG PROM 65K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock10 152 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Altera |
IC CONFIG DEVICE 88UBGA
|
paquet: 88-LFBGA |
Stock7 260 |
|
16Mb | ± 2.25 V ~ 6 V | -40°C ~ 85°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE 1MBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock7 440 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
QPRO FLASH PROM 32MBIT VOG48
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock2 432 |
|
32Mb | 1.65 V ~ 2 V | -55°C ~ 125°C | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Xilinx Inc. |
IC PROM REPROGR 2MB 44-VQFP
|
paquet: 44-TQFP |
Stock29 184 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Altera |
IC CONFIG DEVICE 440KBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock7 392 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock7 788 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 16MBIT 88UBGA
|
paquet: 88-LFBGA |
Stock2 048 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC QUAD-SERIAL CONFIG DEVICE 512
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock5 936 |
|
512Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 192 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |