Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock4 960 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
IC QUAD-SERIAL CONFIG DEVICE 512
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock2 480 |
|
512Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Xilinx Inc. |
IC PROM SERIEAL 10K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 208 |
|
100kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 50K C-TEMP 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 824 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM SRL CONFG 2M LV 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock4 208 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 584 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock3 728 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock2 336 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock45 840 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8LAP
|
paquet: 8-TDFN |
Stock4 320 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock3 200 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock5 824 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock9 348 |
|
400kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 5000 C-TEMP 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 280 |
|
150kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 016 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock78 048 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CONFIG PROM 128K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock3 632 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 128KB 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 592 |
|
128kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SERIAL CONFIG PROM 1M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 032 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC 3V SER CFG PROM 256K 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock16 320 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC CONFIG DEVICE 1MBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock3 152 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM REPROGR 4MB 44-VQFP
|
paquet: 44-TQFP |
Stock3 616 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM REPROGR 2MB 44-VQFP
|
paquet: 44-TQFP |
Stock29 184 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM REPROGR 512KB 44-VQFP
|
paquet: 44-TQFP |
Stock99 000 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock6 976 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Altera |
IC CONFIG DEVICE 32MBIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock9 768 |
|
32Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Altera |
IC CONFIG DEVICE 65KBIT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 696 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SRL FOR 4M GATE 20-TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock261 708 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
paquet: 32-TQFP |
Stock7 560 |
|
1.6Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
AMD |
IC PROM ISP 1MB 3.3V 20TSSOP
|
paquet: - |
Request a Quote |
|
1Mb | 3V ~ 3.6V | -40°C ~ 85°C (TA) | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |