Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC SDRAM 2GBIT 96WBGA
|
paquet: - |
Stock2 144 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 667MHz | - | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | - | - | - |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8USON
|
paquet: - |
Stock7 008 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | 8-USON (4x3) |
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Cypress Semiconductor Corp |
IC FLASH 4MBIT 85MHZ 85MHZ 8SOIC
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock7 392 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI | 85MHz | 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SO |
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Micron Technology Inc. |
IC FLASH/LPDRAM 2GBIT 137TFBGA
|
paquet: 137-TFBGA |
Stock7 072 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (128M x 8)(NAND), 1Gb (32M x 32)(LPDRAM) | Parallel | 166MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 137-TFBGA | 137-TFBGA (10.5x13) |
||
SII Semiconductor Corporation |
IC EEPROM 8KBIT 2MHZ 8SOP
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 760 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 2MHz | 10ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC SRAM 4.5MBIT 133MHZ 176TQFP
|
paquet: 176-LQFP |
Stock3 856 |
|
SRAM | SRAM - Dual Port, Synchronous | 4.5Mb (128K x 36) | Parallel | 133MHz | - | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
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Micron Technology Inc. |
IC FLASH 128MBIT 85NS 56TSOP
|
paquet: 56-TFSOP (0.724", 18.40mm Width) |
Stock4 768 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | 40MHz | 85ns | 85ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 856 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC FLASH 512KBIT 20MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock558 384 |
|
FLASH | FLASH | 512Kb (64K x 8) | SPI | 20MHz | 100µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC NVSRAM 1MBIT 100NS 34PCM
|
paquet: 34-PowerCap? Module |
Stock7 264 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 100ns | 100ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 34-PowerCap? Module | 34-PowerCap Module |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock13 644 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 10ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 36MBIT 7.5NS 100TQFP
|
paquet: 100-LQFP |
Stock7 360 |
|
SRAM | SRAM - Asynchronous | 36Mb (2M x 18) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.465 V | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | 100-LQFP (14x20) |
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Micron Technology Inc. |
IC RLDRAM 576MBIT 1.067GHZ FBGA
|
paquet: 168-TBGA |
Stock7 792 |
|
DRAM | DRAM | 576Mb (16M x 36) | Parallel | 1067MHz | - | 8ns | 1.28 V ~ 1.42 V | 0°C ~ 95°C (TC) | Surface Mount | 168-TBGA | 168-BGA |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18KBIT 35NS 52PLCC
|
paquet: 52-LCC (J-Lead) |
Stock7 200 |
|
SRAM | SRAM - Dual Port, Asynchronous | 18Kb (2K x 9) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18KBIT 55NS 52PLCC
|
paquet: 52-LCC (J-Lead) |
Stock4 912 |
|
SRAM | SRAM - Dual Port, Asynchronous | 18Kb (2K x 9) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Cypress Semiconductor Corp |
IC FLASH 64MBIT 70NS 64BGA
|
paquet: 64-LBGA |
Stock4 256 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | - | 60ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 912 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock3 808 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.5 V ~ 3.6 V | -20°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6 256 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Adesto Technologies |
IC FLASH 4MBIT 104MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 104 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 104MHz | 5µs, 2.5ms | - | 2.5 V ~ 3.6 V | -40°C ~ 125°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock3 136 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Intel |
IC FLASH 32MBIT 110NS 48UBGA
|
paquet: 48-VFBGA |
Stock6 396 |
|
FLASH | FLASH - Boot Block | 32Mb (2M x 16) | Parallel | - | 110ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-µBGA CSP |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 10NS 48VFBGA
|
paquet: 48-VFBGA |
Stock12 288 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
Winbond Electronics |
IC FLASH 16MBIT 133MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock24 900 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Cypress Semiconductor Corp |
IC FRAM 64KBIT 20MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock311 520 |
|
FRAM | FRAM (Ferroelectric RAM) | 64Kb (8K x 8) | SPI | 20MHz | - | - | 2.7 V ~ 3.65 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC EEPROM 4KBIT 1WIRE TO92-3
|
paquet: TO-226-3, TO-92-3 (TO-226AA) |
Stock2 000 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | 1-Wire? | - | - | 2µs | 2.8 V ~ 5.25 V | -40°C ~ 85°C (TA) | Through Hole | TO-226-3, TO-92-3 (TO-226AA) | TO-92-3 |
||
ON Semiconductor |
IC EEPROM 2K SPI 1MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 200 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Micron Technology Inc. |
MLC 512G 64GX8 TSOP DDP
|
paquet: - |
Stock3 808 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32K PARALLEL 100TQFP
|
paquet: 100-LQFP |
Stock6 416 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (2K x 16) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC SDRAM DDR3 8GB FBGA
|
paquet: 96-TFBGA |
Stock7 136 |
|
DRAM | SDRAM - DDR3L | 8Gb (512M x 16) | Parallel | 933MHz | 15ns | 20ns | 1.283V ~ 1.45V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (8x14) |