Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 16GBIT 933MHZ FBGA
|
paquet: - |
Stock3 648 |
|
DRAM | SDRAM - Mobile LPDDR3 | 16Gb (512M x 32) | Parallel | 933MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 64GBIT 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock13 236 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 667MHZ 96FBGA
|
paquet: 96-TFBGA |
Stock7 488 |
|
DRAM | SDRAM - DDR3 | 1Gb (64M x 16) | Parallel | 667MHz | - | - | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (8x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 200MHZ 165CABGA
|
paquet: 165-TBGA |
Stock7 776 |
|
SRAM | SRAM - Synchronous, QDR II | 18Mb (512K x 36) | Parallel | 200MHz | - | 7.88ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 25NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock3 392 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 165FBGA
|
paquet: 165-LBGA |
Stock3 616 |
|
SRAM | SRAM - Synchronous, QDR II | 18Mb (1M x 18) | Parallel | 167MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Winbond Electronics |
IC FLASH 1MBIT 75MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock4 720 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 75MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 2MBIT 120NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock2 976 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20ms | 120ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 400MHZ 60FBGA
|
paquet: 60-FBGA |
Stock4 928 |
|
DRAM | SDRAM - DDR2 | 512Mb (64M x 8) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-FBGA | 60-FBGA |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock7 344 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32DIP
|
paquet: 32-DIP (0.600", 15.24mm) |
Stock2 544 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock27 120 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Micron Technology Inc. |
IC FLASH 64GBIT 153LFBGA
|
paquet: - |
Stock6 720 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 288KBIT 7.5NS 100TQFP
|
paquet: 100-LQFP |
Stock7 792 |
|
SRAM | SRAM - Dual Port, Synchronous | 288Kb (16K x 18) | Parallel | - | - | 7.5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 35NS 80TQFP
|
paquet: 80-LQFP |
Stock4 256 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Micron Technology Inc. |
IC SDRAM 16GBIT 533MHZ FBGA
|
paquet: - |
Stock6 304 |
|
DRAM | SDRAM - Mobile LPDDR2 | 16Gb (256M x 64) | Parallel | 533MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | Surface Mount | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 133MHZ 100TQFP
|
paquet: 100-LQFP |
Stock3 408 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18KBIT 25NS 52PLCC
|
paquet: 52-LCC (J-Lead) |
Stock7 840 |
|
SRAM | SRAM - Dual Port, Asynchronous | 18Kb (2K x 9) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 1067MHZ 96BGA
|
paquet: 96-TFBGA |
Stock19 584 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 1066MHz | - | 20ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (8x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 54BGA
|
paquet: 54-TFBGA |
Stock3 360 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
ISSI, Integrated Silicon Solution Inc |
32MB QSPI 16-PIN SOP 300MIL
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock4 816 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock4 544 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC FLASH NOR 8USON
|
paquet: 8-UDFN Exposed Pad |
Stock2 656 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-USON (4x4) |
||
Rohm Semiconductor |
IC EEPROM 64KBIT 400KHZ 8SOP
|
paquet: 8-SOIC (0.173", 4.40mm Width) |
Stock136 992 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
STMicroelectronics |
IC NVSRAM 256KBIT 70NS 28DIP
|
paquet: 28-DIP Module (0.600", 15.24mm) |
Stock7 040 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-PCDIP, CAPHAT? |
||
ON Semiconductor |
IC EEPROM 1K SPI 1MHZ 8SO
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 336 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 133MHZ 24BGA
|
paquet: 24-TBGA |
Stock2 272 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Cypress Semiconductor Corp |
IC FLASH 8M PARALLEL WAFER
|
paquet: Die |
Stock4 752 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Wafer |
||
Micron Technology Inc. |
IC FLASH 256M SPI 133MHZ 8WPDFN
|
paquet: 8-WDFN Exposed Pad |
Stock5 232 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WPDFN (6x5)(MLP8) |
||
Micron Technology Inc. |
IC FLASH 64G MMC
|
paquet: 100-LBGA |
Stock5 024 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LBGA | 100-LBGA (14x18) |