Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc. |
IC THERMO COOLER DRIVER 36LFCSP
|
paquet: 36-WFQFN Exposed Pad |
Stock7 040 |
|
3.3mA | 2.7 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 36-WFQFN Exposed Pad | 36-LFCSP (6x6) |
||
Microsemi Corporation |
IC SWITCHING REGULATOR TO66
|
paquet: TO-213AA, TO-66-4 |
Stock5 888 |
|
- | 80V | -55°C ~ 125°C | Through Hole | TO-213AA, TO-66-4 | TO-66 |
||
Allegro MicroSystems, LLC |
IC PHOTOFLASH CAP CHARGER 16QFN
|
paquet: 16-WFQFN Exposed Pad |
Stock6 576 |
|
- | 3 V ~ 5.5 V | - | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN/MLP (3x3) |
||
NXP |
IC MULT VOLT REG W/SWITCH 13-SIL
|
paquet: 13-SIP Formed Leads |
Stock3 696 |
|
500µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Through Hole | 13-SIP Formed Leads | 13-PDBS |
||
Allegro MicroSystems, LLC |
PHOTOFLASH CAP CHRGR 10TDFN
|
paquet: 10-WFDFN Exposed Pad |
Stock181 656 |
|
- | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 10-WFDFN Exposed Pad | 10-TDFN/MLP (3x3) |
||
Microchip Technology |
IC FLASHER W/TRAILER CTRL 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 072 |
|
- | 9 V ~ 15 V | -40°C ~ 95°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Texas Instruments |
IC PMU FOR APP PROCESSOR 48WQFN
|
paquet: 48-WFQFN Exposed Pad |
Stock5 296 |
|
- | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
Intersil |
IC CTRLR PWM DUAL 1.4MHZ 28-QFN
|
paquet: 28-VFQFN Exposed Pad |
Stock7 856 |
|
2mA | 5.6 V ~ 24 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-QFN (5x5) |
||
Microchip Technology |
IC ULTRASOUND PULSER
|
paquet: 48-VFQFN Exposed Pad |
Stock4 960 |
|
- | 8 V ~ 12 V | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Maxim Integrated |
IC DIGITAL PULSER DL 56TQFN
|
paquet: 56-WFQFN Exposed Pad |
Stock4 592 |
|
36mA | 2.7 V ~ 6 V | 0°C ~ 70°C | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN-EP (7x7) |
||
STMicroelectronics |
IC MULT6IPLE PWR SUPPLY 64LQFP
|
paquet: - |
Stock6 352 |
|
- | 4.5 V ~ 19 V | - | - | - | - |
||
Linear Technology |
IC 2CELL SUPERCAP CHARGE 16QFN
|
paquet: 16-WFQFN Exposed Pad |
Stock6 704 |
|
10µA | 2.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC LOAD SHARE CTRLR ADV 8VSSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4 352 |
|
2.5mA | 4.375 V ~ 14.25 V | -40°C ~ 105°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-VSSOP |
||
Rohm Semiconductor |
IC POWER SWITCH 20-SSOP
|
paquet: 20-LSSOP (0.173", 4.40mm Width) |
Stock5 056 |
|
250µA | 3 V ~ 3.6 V | -40°C ~ 100°C | Surface Mount | 20-LSSOP (0.173", 4.40mm Width) | 20-SSOP-B |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
paquet: - |
Stock6 848 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-16
|
paquet: - |
Stock5 376 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
IRON CONTROLLER SO-8
|
paquet: - |
Stock2 304 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
IC HEATING CONTROLLER 16SOIC
|
paquet: - |
Stock4 416 |
|
- | 4 V ~ 5.5 V | -20°C ~ 85°C | - | - | - |
||
Linear Technology |
IC DC/DC CONV 8-OUTPUT 40QFN
|
paquet: 40-WFQFN Exposed Pad |
Stock7 392 |
|
8µA | 2.7 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 40-WFQFN Exposed Pad | 40-QFN (6x6) |
||
NXP |
IC PMU I.MX35/51/37/27 186BGA
|
paquet: 186-LFBGA |
Stock14 172 |
|
- | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
||
Texas Instruments |
IC DDR-II TERM REG 8SOPWRPAD
|
paquet: 8-PowerSOIC (0.154", 3.90mm Width) |
Stock190 488 |
|
320µA | 2.2 V ~ 5.5 V | 0°C ~ 125°C | Surface Mount | 8-PowerSOIC (0.154", 3.90mm Width) | 8-SO PowerPad |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock5 424 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock4 048 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Corporation |
ACTIVE BYPASS DEVICE
|
paquet: - |
Stock6 944 |
|
- | - | -55°C ~ 90°C | - | - | - |
||
Maxim Integrated |
LOAD-DUMP/REVERSE-VOLTAGE PROTEC
|
paquet: - |
Stock6 272 |
|
- | - | - | - | - | - |
||
Rohm Semiconductor |
CELL BALANCE LSI OF 4 TO 6 SERIE
|
paquet: 30-VSSOP (0.220", 5.60mm Width) Exposed Pad |
Stock4 512 |
|
40µA | 8 V ~ 24 V | -40°C ~ 105°C | Surface Mount | 30-VSSOP (0.220", 5.60mm Width) Exposed Pad | 30-HTSSOP-B |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 8-WFDFN Exposed Pad |
Stock4 992 |
|
125µA | 2.5 V ~ 34 V | 0°C ~ 70°C | Surface Mount | 8-WFDFN Exposed Pad | 8-DFN (3x2) |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
paquet: - |
Stock4 096 |
|
- | 3.5 V ~ 5.5 V | -20°C ~ 85°C (TA) | - | - | - |
||
Rohm Semiconductor |
SYSTEM PMIC FOR I.MX 8M FAMILY
|
paquet: 68-VFQFN Exposed Pad |
Stock5 248 |
|
197µA | 2.7V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | UQFN68CV8080 |
||
ams |
IC REGULATOR WLCSP
|
paquet: 36-UFBGA, WLCSP |
Stock3 456 |
|
110µA | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 36-UFBGA, WLCSP | 36-WLCSP (2.54x2.4) |