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Produits Microchip Technology - Oscillateurs - Sélectionnables/configurables par broche

Dossiers 325
Page  10/11
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Frequency - Output 1
Frequency - Output 2
Function
Output
Voltage - Supply
Frequency Stability
Operating Temperature
Current - Supply (Max)
Size / Dimension
Height
Package / Case
DSC400-2222Q0022KE2
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVPECL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 302
-
-
Enable/Disable
LVPECL
2.25 V ~ 3.6 V
±25ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-2222Q0022KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVPECL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock3 762
-
-
Enable/Disable
LVPECL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-2222Q0022KE1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVPECL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock5 724
-
-
Enable/Disable
LVPECL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0060KI2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock3 600
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0060KI2
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock6 084
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0060KI1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 986
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0060KI1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 446
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0060KE2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock7 488
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±25ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0060KE2
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 428
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±25ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0060KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 610
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0060KE1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 572
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0052KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 212
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1444Q0052KE1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 286
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0058KI1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock8 982
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0058KI1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock6 732
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0058KE2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 878
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±25ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0058KE2
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock6 084
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±25ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0058KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock6 930
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0058KE1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 590
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0007KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock7 128
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0007KE1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock3 150
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0344Q0051KI1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock7 722
-
-
Enable/Disable
HCSL, LVDS
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0344Q0051KI1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock8 280
-
-
Enable/Disable
HCSL, LVDS
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0344Q0051KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 790
-
-
Enable/Disable
HCSL, LVDS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0344Q0051KE1
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock6 192
-
-
Enable/Disable
HCSL, LVDS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC2311KM1-R0036T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 25MHz
  • Frequency - Output 2: 20MHz
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -55°C ~ 125°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock6 048
25MHz
20MHz
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±50ppm
-55°C ~ 125°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead
DSC2311KM1-R0036
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 25MHz
  • Frequency - Output 2: 20MHz
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -55°C ~ 125°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock5 184
25MHz
20MHz
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±50ppm
-55°C ~ 125°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead
DSC2311KL2-R0015T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 24MHz
  • Frequency - Output 2: 25MHz
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 105°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock7 614
24MHz
25MHz
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 105°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead
DSC2311KL2-R0015
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 24MHz
  • Frequency - Output 2: 25MHz
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 105°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock7 560
24MHz
25MHz
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 105°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead
DSC2311KL2-R0009T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 25MHz
  • Frequency - Output 2: 25MHz
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 105°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock4 662
25MHz
25MHz
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 105°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead