Page 5 - Produits Microchip Technology - Oscillateurs - Sélectionnables/configurables par broche | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 813
Language Translation

* Please refer to the English Version as our Official Version.

Produits Microchip Technology - Oscillateurs - Sélectionnables/configurables par broche

Dossiers 325
Page  5/11
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Frequency - Output 1
Frequency - Output 2
Function
Output
Voltage - Supply
Frequency Stability
Operating Temperature
Current - Supply (Max)
Size / Dimension
Height
Package / Case
DSC400-4444Q0024KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 304
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-4444Q0023KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock7 200
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-4444Q0022KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock3 186
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-4444Q0015KE2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 25MHz, 50MHz, 125MHz, 150MHz
  • Frequency - Output 2: 100MHz, 156.25MHz
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock7 794
25MHz, 50MHz, 125MHz, 150MHz
100MHz, 156.25MHz
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±25ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-4444Q0015KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 25MHz, 50MHz, 125MHz, 150MHz
  • Frequency - Output 2: 100MHz, 156.25MHz
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock8 226
25MHz, 50MHz, 125MHz, 150MHz
100MHz, 156.25MHz
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-4134Q0050KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS, LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 644
-
-
Enable/Disable
HCSL, LVCMOS, LVDS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-4134Q0028KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS, LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock5 364
-
-
Enable/Disable
HCSL, LVCMOS, LVDS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-3443Q0022KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 464
-
-
Enable/Disable
HCSL, LVDS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-3333Q0041KI2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 142
-
-
Enable/Disable
LVDS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-2222Q0047KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVPECL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 934
-
-
Enable/Disable
LVPECL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1122Q0036KI1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS, LVPECL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock3 852
-
-
Enable/Disable
LVCMOS, LVPECL
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1122Q0036KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS, LVPECL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 896
-
-
Enable/Disable
LVCMOS, LVPECL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1111Q0044KI2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock3 780
-
-
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1111Q0043KI2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 628
-
-
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1111Q0034KI1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock5 292
-
-
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1111Q0034KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 070
-
-
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1111Q0025KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 986
-
-
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1111Q0019KI2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 25MHz, 50MHz, 125MHz, 150MHz
  • Frequency - Output 2: 100MHz, 156.25MHz
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock4 248
25MHz, 50MHz, 125MHz, 150MHz
100MHz, 156.25MHz
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-1111Q0001KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: 25MHz, 50MHz, 125MHz, 150MHz
  • Frequency - Output 2: 100MHz, 156.25MHz
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock5 346
25MHz, 50MHz, 125MHz, 150MHz
100MHz, 156.25MHz
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0414Q0033KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL, LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 178
-
-
Enable/Disable
HCSL, LVCMOS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0404Q0020KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: HCSL
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock3 168
-
-
Enable/Disable
HCSL
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0333Q0040KI2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock7 866
-
-
Enable/Disable
LVDS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0333Q0032KE1T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock7 866
-
-
Enable/Disable
LVDS
2.25 V ~ 3.6 V
±50ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0331Q0026KI2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS, LVDS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock2 592
-
-
Enable/Disable
LVCMOS, LVDS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC400-0111Q0029KE2T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: LVCMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -20°C ~ 70°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 20-VFQFN Exposed Pad
paquet: 20-VFQFN Exposed Pad
Stock3 454
-
-
Enable/Disable
LVCMOS
2.25 V ~ 3.6 V
±25ppm
-20°C ~ 70°C
-
0.197" L x 0.126" W (5.00mm x 3.20mm)
0.035" (0.90mm)
20-VFQFN Exposed Pad
DSC2311KL2-R0027T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: CMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 105°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock4 716
-
-
Enable/Disable
CMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 105°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead
DSC2311KL2-R0018T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: CMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 105°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock3 888
-
-
Enable/Disable
CMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 105°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead
DSC2311KL1-R0009T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: CMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 105°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock7 470
-
-
Enable/Disable
CMOS
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 105°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead
DSC2311KI2-R0020T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: CMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock5 904
-
-
Enable/Disable
CMOS
2.25 V ~ 3.6 V
±25ppm
-40°C ~ 85°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead
DSC2311KI1-R0015T
Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

  • Type: MEMS (Silicon)
  • Frequency - Output 1: -
  • Frequency - Output 2: -
  • Function: Enable/Disable
  • Output: CMOS
  • Voltage - Supply: 2.25 V ~ 3.6 V
  • Frequency Stability: ±50ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): -
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height: 0.035" (0.90mm)
  • Package / Case: 6-SMD, No Lead
paquet: 6-SMD, No Lead
Stock8 298
-
-
Enable/Disable
CMOS
2.25 V ~ 3.6 V
±50ppm
-40°C ~ 85°C
-
0.098" L x 0.079" W (2.50mm x 2.00mm)
0.035" (0.90mm)
6-SMD, No Lead