Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TXRX LIN 3.3V LDO 14-TSSOP
|
paquet: 14-TSSOP (0.173", 4.40mm Width) |
Stock4 624 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC TXRX LIN 5.0V LDO 14-TSSOP
|
paquet: 14-TSSOP (0.173", 4.40mm Width) |
Stock6 336 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC TXRX ETHERNET 100MBPS 48LQFP
|
paquet: 48-LQFP |
Stock5 328 |
|
Ethernet | 1/1 | Full | - | 100Mbps | 3.3V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Microchip Technology |
IC TXRX USB FLEXPWR 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock6 016 |
|
USB 2.0 | - | - | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock4 880 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC LIN BUS BIDIRECT 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock8 148 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX CAN VIO 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock7 344 |
|
CAN | 1/1 | - | 120mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (3x3) |
||
Microchip Technology |
IC TXRX USB 2.0 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock13 200 |
|
USB 2.0 | 1/1 | - | 150mV | - | - | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock13 224 |
|
MII, RMII | 4/4 | Full | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN (5x5) |
||
Microchip Technology |
IC TXRX LIN 5V 50MA 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock216 708 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock19 812 |
|
MII, RMII | 4/4 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN (5x5) |
||
Microchip Technology |
IC TXRX ETHERNET 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock17 388 |
|
RMII | 2/2 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-SQFN (4x4) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 704 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock10 008 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock16 260 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock15 528 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock16 368 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC DRVR COAX CABLE 3.3V/5V 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock954 600 |
|
- | 2/0 | - | - | - | 3.3V, 5V | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC TXRX LIN 3.3V 70MA 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock6 320 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock9 600 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 3.3V LDO 8-DFN
|
paquet: 8-VDFN Exposed Pad |
Stock8 724 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock8 616 |
|
Ethernet | 1/1 | - | - | - | 1.6 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN (5x5) |
||
Microchip Technology |
IC TXRX LIN 5V 70MA 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock8 688 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock6 576 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock9 372 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN HS W/SPLIT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 276 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC LIN BUS BIDIRECT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock16 056 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX LIN 3.3V 70MA 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock9 636 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock41 352 |
|
MII, RMII | 4/4 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN Exposed Pad (5x5) |
||
Microchip Technology |
IC TXRX LIN 3.3V LDO 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock565 200 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |