Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Interrupt Output | Features | Output Type | Current - Output Source/Sink | Clock Frequency | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC I/O EXPANDER I2C 16B 28QFN
|
paquet: 28-VQFN Exposed Pad |
Stock15 156 |
|
I2C | Yes | POR | Push-Pull | 25mA | 400kHz | 2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock9 204 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 18SOIC
|
paquet: 18-SOIC (0.295", 7.50mm Width) |
Stock13 140 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 24SSOP
|
paquet: 24-SSOP (0.209", 5.30mm Width) |
Stock9 216 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC EXPANDER SPI 16BIT I/O 28SDIP
|
paquet: 28-DIP (0.300", 7.62mm) |
Stock15 588 |
|
SPI | Yes | - | Open Drain | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 28-DIP (0.300", 7.62mm) | 28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SDIP
|
paquet: 28-DIP (0.300", 7.62mm) |
Stock9 576 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 28-DIP (0.300", 7.62mm) | 28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18SOIC
|
paquet: 18-SOIC (0.295", 7.50mm Width) |
Stock8 004 |
|
SPI | Yes | - | Open Drain | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock8 844 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18DIP
|
paquet: 18-DIP (0.300", 7.62mm) |
Stock17 940 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28QFN
|
paquet: 28-VQFN Exposed Pad |
Stock2 896 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock12 504 |
|
CAN V2.0b | No | ADC, EEPROM, PWM | Push-Pull | 25mA | 4MHz | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock11 784 |
|
CAN V2.0b | No | ADC, EEPROM, PWM | Push-Pull | 25mA | 4MHz | 2.75 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SDIP
|
paquet: 28-DIP (0.300", 7.62mm) |
Stock14 244 |
|
I2C | Yes | POR | Push-Pull | 25mA | 400kHz | 2 V ~ 5.5 V | -40°C ~ 85°C | Through Hole | 28-DIP (0.300", 7.62mm) | 28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 18DIP
|
paquet: 18-DIP (0.300", 7.62mm) |
Stock13 722 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SSOP
|
paquet: 28-SSOP (0.209", 5.30mm Width) |
Stock14 940 |
|
I2C | Yes | POR | Push-Pull | 25mA | 400kHz | 2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock6 608 |
|
SPI | Yes | - | Open Drain | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock14 052 |
|
SPI | Yes | - | Open Drain | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28QFN
|
paquet: 28-VQFN Exposed Pad |
Stock6 176 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock13 896 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28QFN
|
paquet: 28-VQFN Exposed Pad |
Stock4 976 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SSOP
|
paquet: 28-SSOP (0.209", 5.30mm Width) |
Stock8 712 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock20 160 |
|
SPI | Yes | - | Open Drain | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SDIP
|
paquet: 28-DIP (0.300", 7.62mm) |
Stock6 416 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 28-DIP (0.300", 7.62mm) | 28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SSOP
|
paquet: 28-SSOP (0.209", 5.30mm Width) |
Stock179 340 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock44 616 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock221 532 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock5 840 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SDIP
|
paquet: 28-DIP (0.300", 7.62mm) |
Stock7 568 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 28-DIP (0.300", 7.62mm) | 28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock14 916 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 20QFN
|
paquet: 20-VFQFN Exposed Pad |
Stock7 232 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) |