Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Channel Type | Number of Drivers | Gate Type | Voltage - Supply | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | Input Type | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock5 520 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock22 680 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock16 932 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock20 244 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock18 996 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock14 580 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock6 928 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 504 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 800 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 496 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6 896 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock7 840 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 200 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock29 574 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock27 234 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock15 816 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock14 952 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock14 520 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
LOW-SIDE MOSFET DRIVER
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock19 632 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
LOW-SIDE MOSFET DRIVER
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock19 722 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
LOW-SIDE MOSFET DRIVER
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock23 826 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock15 810 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock14 496 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock22 332 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock13 710 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock12 126 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock13 866 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock25 920 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock29 658 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
paquet: 8-WFDFN Exposed Pad |
Stock30 570 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |