Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU I.MX6ULZ 900MHZ 196MAPBGA
|
paquet: 289-LFBGA |
Stock8 640 |
|
1 Core, 32-Bit | 900MHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | Keypad | - | - | USB 2.0 OTG + PHY (2) | - | 0°C ~ 95°C (TJ) | A-HAB, ARM TZ, CSU, SJC, SNVS | 289-LFBGA | 289-MAPBGA (14x14) |
||
NXP |
I.MXRT1020 100LQFP
|
paquet: - |
Stock12 168 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MXRT1050
|
paquet: 196-LFBGA |
Stock7 344 |
|
1 Core, 32-Bit | 528MHz | - | SDRAM | Yes | LCD | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | -40°C ~ 105°C (TJ) | BEE, DCP, HAB, SJC, SNVS, TRNG | 196-LFBGA | 196-MAPBGA (10x10) |
||
NXP |
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
paquet: 624-LFBGA |
Stock10 368 |
|
2 Core, 32-Bit | 1GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
NXP |
I.MXRT1050 A1
|
paquet: 196-LFBGA |
Stock15 060 |
|
1 Core, 32-Bit | 600MHz | - | SDRAM | Yes | LCD | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | 0°C ~ 95°C (TJ) | BEE, DCP, HAB, SJC, SNVS, TRNG | 196-LFBGA | 196-MAPBGA (10x10) |
||
NXP |
I.MXRT1050 A1
|
paquet: 196-LFBGA |
Stock20 196 |
|
1 Core, 32-Bit | 528MHz | - | SDRAM | Yes | LCD | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | -40°C ~ 105°C (TJ) | BEE, DCP, HAB, SJC, SNVS, TRNG | 196-LFBGA | 196-MAPBGA (10x10) |
||
NXP |
I.MXRT1050
|
paquet: 196-LFBGA |
Stock18 360 |
|
1 Core, 32-Bit | 600MHz | - | SDRAM | Yes | LCD | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | 0°C ~ 95°C (TJ) | BEE, DCP, HAB, SJC, SNVS, TRNG | 196-LFBGA | 196-MAPBGA (10x10) |
||
NXP |
IC MPU I.MX6D ENHANCED 624FCBGA
|
paquet: 624-FBGA, FCBGA |
Stock8 340 |
|
4 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
|
paquet: 783-BBGA, FCBGA |
Stock2 656 |
|
1 Core, 32-Bit | 667MHz | Communications; CPM, Security; SEC | DDR, SDRAM | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 2.5V, 3.3V | 0°C ~ 105°C | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC SOC 64BIT 8X1.2GHZ 896FCBGA
|
paquet: 896-BFBGA, FCBGA |
Stock2 544 |
|
4 Core, 64-Bit | 1.2GHz | - | DDR3, DDR3L | No | - | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | 896-BFBGA, FCBGA | 896-FCPBGA (25x25) |
||
NXP |
IC MPU POWERQUICC 80MHZ 357PBGA
|
paquet: 357-BBGA |
Stock6 848 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU PWRQUICC II 672-TBGA
|
paquet: 672-LBGA |
Stock3 376 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU 533MHZ 561-TEPBGA1
|
paquet: 561-FBGA |
Stock4 032 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 561-FBGA | 561-TEPBGA I (23x23) |
||
NXP |
MPU POWERQUICC II 533MHZ 689PBGA
|
paquet: 689-BBGA Exposed Pad |
Stock7 296 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU 667MHZ 561-TEPBGA1
|
paquet: 561-FBGA |
Stock7 824 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 561-FBGA | 561-TEPBGA I (23x23) |
||
NXP |
IC MPU 400MHZ 561-TEPBGA1
|
paquet: 561-FBGA |
Stock5 744 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 561-FBGA | 561-TEPBGA I (23x23) |
||
NXP |
IC MPU 533MHZ 689-TEPBGA2
|
paquet: 689-BBGA Exposed Pad |
Stock3 344 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU 667MHZ 561-TEPBGA1
|
paquet: 561-FBGA |
Stock7 440 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 561-FBGA | 561-TEPBGA I (23x23) |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
paquet: 516-BBGA Exposed Pad |
Stock3 360 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
paquet: 516-BBGA Exposed Pad |
Stock6 192 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
paquet: 516-BBGA Exposed Pad |
Stock2 100 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
paquet: 516-BBGA Exposed Pad |
Stock2 176 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
paquet: 516-BBGA Exposed Pad |
Stock6 976 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IMX53 REV 2.1 AUTO
|
paquet: 529-FBGA |
Stock6 512 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 529-FBGA | 529-FBGA (19x19) |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
paquet: 516-BBGA Exposed Pad |
Stock2 064 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
paquet: 516-BBGA Exposed Pad |
Stock5 744 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
paquet: 516-BBGA Exposed Pad |
Stock5 472 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU I.MX 8M MINI DUAL BGA
|
paquet: 486-LFBGA, FCBGA |
Stock5 312 |
|
2 Core, 32-Bit | 1.6GHz | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | 486-LFBGA, FCBGA | 486-FCBGA (14x14) |
||
NXP |
IC MPU I.MX 8M MINI SOLO BGA
|
paquet: 486-LFBGA, FCBGA |
Stock4 624 |
|
1 Core, 32-Bit | 1.6GHz | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | 486-LFBGA, FCBGA | 486-FCBGA (14x14) |
||
NXP |
IC MPU I.MX 8M MINI DUALLITE
|
paquet: 486-LFBGA, FCBGA |
Stock5 280 |
|
2 Core, 32-Bit | 1.6GHz | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | 486-LFBGA, FCBGA | 486-FCBGA (14x14) |