Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Voltage - Input | Number of Outputs | Voltage - Output | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock2 272 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock7 904 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock7 456 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock6 688 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock6 864 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock4 352 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock5 328 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock5 712 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock2 448 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC CONVERTER DDR 26QFN
|
paquet: 26-VFQFN Exposed Pad |
Stock4 288 |
|
3 V ~ 6 V | 2 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 26-VFQFN Exposed Pad | 26-QFN-EP (5x5) |
||
NXP |
IC CONVERTER DDR 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock2 592 |
|
3 V ~ 6 V | 1 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
IC CONVERTER DDR 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock3 360 |
|
3 V ~ 6 V | 1 | 0.7 V ~ 1.35 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
IC CONVERTER DDR 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock3 760 |
|
3 V ~ 6 V | 1 | 0.7 V ~ 1.35 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
ALTERNATOR REGULATOR, 14V 12A, L
|
paquet: Die |
Stock2 100 |
|
5 V ~ 16.5 V | 1 | 10.6 V ~ 16 V | -40°C ~ 150°C | Surface Mount | Die | Die |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock7 680 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 105°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC CONVERTER DDR 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock6 448 |
|
3 V ~ 6 V | 1 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock2 400 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 105°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC SYSTEM BASIS CHIP CAN 48LQFP
|
paquet: 48-LQFP Exposed Pad |
Stock5 984 |
|
-1 V ~ 40 V | 6 | Multiple | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP CAN 48LQFP
|
paquet: 48-LQFP Exposed Pad |
Stock7 808 |
|
-1 V ~ 40 V | 6 | Multiple | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock20 796 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 105°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock7 824 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock6 780 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock6 012 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock20 742 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC CONVERTER DDR 26QFN
|
paquet: 26-VFQFN Exposed Pad |
Stock5 392 |
|
3 V ~ 6 V | 2 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 26-VFQFN Exposed Pad | 26-QFN-EP (5x5) |
||
NXP |
IC SYSTEM BASIS CAN 1.5A 48LQFP
|
paquet: 48-LQFP Exposed Pad |
Stock6 416 |
|
-1 V ~ 40 V | 6 | Multiple | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC SYSTEM BASIS CAN 0.8A 48LQFP
|
paquet: 48-LQFP Exposed Pad |
Stock7 080 |
|
-1 V ~ 40 V | 6 | Multiple | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock13 578 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock32 064 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC CONVERTER DDR 26QFN
|
paquet: 26-VFQFN Exposed Pad |
Stock6 224 |
|
3 V ~ 6 V | 2 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 26-VFQFN Exposed Pad | 26-QFN-EP (5x5) |