Page 13 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
LD6805K/14H,115	NXP	IC REG LIN 1.4V 150MA DFN1010C-4 Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.4V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UDFN Exposed Pad Supplier Device Package: DFN1010C-4	paquet: 4-UDFN Exposed Pad	Stock2 032
TLVH431DQDBVR,125	NXP	IC VREF SHUNT ADJ 5TSOP Reference Type: Shunt Output Type: Adjustable Voltage - Output (Min/Fixed): 1.24V Voltage - Output (Max): 18V Current - Output: 70mA Tolerance: ±0.75% Temperature Coefficient: - Noise - 0.1Hz to 10Hz: - Noise - 10Hz to 10kHz: - Voltage - Input: - Current - Supply: - Current - Cathode: 80µA Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	paquet: SC-74A, SOT-753	Stock4 848
PCA9633D16,112	NXP	IC LED DRIVER PS DIM 25MA 16SO Type: Power Switch Topology: - Internal Switch(s): Yes Number of Outputs: 4 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: 5.5V Current - Output / Channel: 25mA Frequency: - Dimming: PWM Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	paquet: 16-SOIC (0.154", 3.90mm Width)	Stock19 728
N74F273AN,602	NXP	IC D-TYPE POS TRG SNGL 20DIP Function: Master Reset Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 170MHz Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 38mA Input Capacitance: - Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm)	paquet: 20-DIP (0.300", 7.62mm)	Stock6 672
74HCT4059D,112	NXP	IC PROG DIVIDE-BY-N COUNT 24SOIC Logic Type: Divide-by-N Direction: Down Number of Elements: 1 Number of Bits per Element: 16 Reset: Asynchronous Timing: Synchronous Count Rate: 36MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	paquet: 24-SOIC (0.295", 7.50mm Width)	Stock4 320
TDA18273HN/C1,551	NXP	IC SILICON TUNER HYBRID 40HVQFN Type: Silicon Tuner Applications: TV Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	paquet: 40-VFQFN Exposed Pad	Stock5 760
PCA9506BS,118	NXP	IC I/O EXPANDER I2C 40B 56HVQFN Number of I/O: 40 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	paquet: 56-VFQFN Exposed Pad	Stock80 574
MC33662BSEFR2	NXP	IC TXRX LIN 2.1 10KBPS 8SOIC Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: - Data Rate: 20kbps Voltage - Supply: 7 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	paquet: 8-SOIC (0.154", 3.90mm Width)	Stock5 680
SC16IS750IBS,157	NXP	IC UART 64BYTE 24HVQFN Protocol: RS232, RS485 Function: Controller Interface: I2C, SPI, UART Standards: - Voltage - Supply: 2.5V, 3.3V Current - Supply: 6mA Operating Temperature: -40°C ~ 95°C Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	paquet: 24-VFQFN Exposed Pad	Stock4 064
MC8641THX1000NC	NXP	IC MPU MPC86XX 1.0GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	paquet: 994-BCBGA, FCCBGA	Stock5 808
MC68EC000EI20	NXP	IC MPU M680X0 20MHZ 68PLCC Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 20MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	paquet: 68-LCC (J-Lead)	Stock7 040
S9S08DZ60F1VLH	NXP	IC MCU 8BIT 60KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	paquet: 64-LQFP	Stock15 096
MC908QY1AMDWER	NXP	IC MCU 8BIT 1.5KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	paquet: 16-SOIC (0.295", 7.50mm Width)	Stock2 400
MC908AS32ACFNE	NXP	IC MCU 8BIT 32KB FLASH 52PLCC Core Processor: HC08 Core Size: 8-Bit Speed: 8.4MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 15x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	paquet: 52-LCC (J-Lead)	Stock4 944
MCF51MM128VMB	NXP	IC MCU 32BIT 128KB FLASH 81BGA Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 48 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x16b, D/A 1x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 81-LBGA Supplier Device Package: 81-MAPBGA (10x10)	paquet: 81-LBGA	Stock4 064
LPC1112FHN33/201,5	NXP	IC MCU 32BIT 16KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	paquet: 32-VQFN Exposed Pad	Stock5 712
LPC1754FBD80,551	NXP	IC MCU 32BIT 128KB FLASH 80LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Number of I/O: 52 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 6x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	paquet: 80-LQFP	Stock4 752
MPC9773FA	NXP	IC CLOCK GEN PLL LV 1:12 52-LQFP Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer PLL: Yes with Bypass Input: LVCMOS, LVPECL Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 3:12 Differential - Input:Output: Yes/No Frequency - Max: 242.5MHz Divider/Multiplier: Yes/No Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	paquet: 52-LQFP	Stock4 848
TEF6892H/V2,518	NXP	IC RADIO SIGNAL PROC 44-QFP Function: Audio Tone Processor Applications: Automotive Audio Number of Channels: 6 Interface: I2C Voltage - Supply: 8 V ~ 9 V Operating Temperature: -40°C ~ 85°C (TA) Specifications: AM, FM Package / Case: 44-QFP Supplier Device Package: 44-PQFP (10x10)	paquet: 44-QFP	Stock5 920
TDA8270AHN/C1,557	NXP	IC TUNER DGTL CBL MODEM 40HVQFN Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: - Applications: General Purpose Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 3.3V Operating Temperature: -40°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	paquet: 40-VFQFN Exposed Pad	Stock5 526
OM7863/BGA3015/RAMP,598	NXP	BOARD OM7863 BGA3015 Type: Amplifier Frequency: 5MHz ~ 300MHz For Use With/Related Products: BGA3015 Supplied Contents: Board, Samples	paquet: -	Stock8 208
LS1084ASE7PTA	NXP	LS1084A 1400/1800 ST WE Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Stock4 176
SP5748GSK0AVKU2R	NXP	TRIPLE CORE, 6M FLASH Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	paquet: 176-LQFP Exposed Pad	Stock4 304
LS1018ASE7PQA	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: USB 3.0 (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	paquet: -	Request a Quote
FG32K144HAT0MLLR	NXP	IC Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
MCIMX537CVP8C2R2	NXP	IC MPU I.MX53 800MHZ 529FBGA Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 529-FBGA Supplier Device Package: 529-FBGA (19x19)	paquet: -	Request a Quote
MC33PF8100CCESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	paquet: -	Request a Quote
SAF7770EL-101S130K	NXP	SOFTWARE DEFINED RADIO Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	paquet: -	Request a Quote
FS32K144HAT0VLFR	NXP	S32K144, 512K FLASH, 64K RAM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Number of I/O: 89 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: -	Request a Quote
S9S12GA64J0MLFR	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: -	Request a Quote

LD6805K/14H,115

NXP

IC REG LIN 1.4V 150MA DFN1010C-4

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.4V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.25V @ 150mA
Current - Output: 150mA
Current - Quiescent (Iq): -
Current - Supply (Max): 35µA ~ 150µA
PSRR: 75dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Transient Voltage
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-UDFN Exposed Pad
Supplier Device Package: DFN1010C-4

paquet: 4-UDFN Exposed Pad

Stock2 032

TLVH431DQDBVR,125

NXP

IC VREF SHUNT ADJ 5TSOP

Reference Type: Shunt
Output Type: Adjustable
Voltage - Output (Min/Fixed): 1.24V
Voltage - Output (Max): 18V
Current - Output: 70mA
Tolerance: ±0.75%
Temperature Coefficient: -
Noise - 0.1Hz to 10Hz: -
Noise - 10Hz to 10kHz: -
Voltage - Input: -
Current - Supply: -
Current - Cathode: 80µA
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

paquet: SC-74A, SOT-753

Stock4 848

PCA9633D16,112

NXP

IC LED DRIVER PS DIM 25MA 16SO

Type: Power Switch
Topology: -
Internal Switch(s): Yes
Number of Outputs: 4
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Voltage - Output: 5.5V
Current - Output / Channel: 25mA
Frequency: -
Dimming: PWM
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

Stock19 728

N74F273AN,602

NXP

IC D-TYPE POS TRG SNGL 20DIP

Function: Master Reset
Type: D-Type
Output Type: Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 170MHz
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 38mA
Input Capacitance: -
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)

paquet: 20-DIP (0.300", 7.62mm)

Stock6 672

74HCT4059D,112

NXP

IC PROG DIVIDE-BY-N COUNT 24SOIC

Logic Type: Divide-by-N
Direction: Down
Number of Elements: 1
Number of Bits per Element: 16
Reset: Asynchronous
Timing: Synchronous
Count Rate: 36MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

paquet: 24-SOIC (0.295", 7.50mm Width)

Stock4 320

TDA18273HN/C1,551

NXP

IC SILICON TUNER HYBRID 40HVQFN

Type: Silicon Tuner
Applications: TV
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

paquet: 40-VFQFN Exposed Pad

Stock5 760

PCA9506BS,118

NXP

IC I/O EXPANDER I2C 40B 56HVQFN

Number of I/O: 40
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

paquet: 56-VFQFN Exposed Pad

Stock80 574

MC33662BSEFR2

NXP

IC TXRX LIN 2.1 10KBPS 8SOIC

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: -
Data Rate: 20kbps
Voltage - Supply: 7 V ~ 18 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC

paquet: 8-SOIC (0.154", 3.90mm Width)

Stock5 680

SC16IS750IBS,157

NXP

IC UART 64BYTE 24HVQFN

Protocol: RS232, RS485
Function: Controller
Interface: I2C, SPI, UART
Standards: -
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Operating Temperature: -40°C ~ 95°C
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

paquet: 24-VFQFN Exposed Pad

Stock4 064

MC8641THX1000NC

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

paquet: 994-BCBGA, FCCBGA

Stock5 808

MC68EC000EI20

NXP

IC MPU M680X0 20MHZ 68PLCC

Core Processor: EC000
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 20MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (25x25)

paquet: 68-LCC (J-Lead)

Stock7 040

S9S08DZ60F1VLH

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 53
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

Stock15 096

MC908QY1AMDWER

NXP

IC MCU 8BIT 1.5KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

Stock2 400

MC908AS32ACFNE

NXP

IC MCU 8BIT 32KB FLASH 52PLCC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8.4MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 40
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 15x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

paquet: 52-LCC (J-Lead)

Stock4 944

MCF51MM128VMB

NXP

IC MCU 32BIT 128KB FLASH 81BGA

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Number of I/O: 48
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x16b, D/A 1x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 81-LBGA
Supplier Device Package: 81-MAPBGA (10x10)

paquet: 81-LBGA

Stock4 064

LPC1112FHN33/201,5

NXP

IC MCU 32BIT 16KB FLASH 33HVQFN

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VQFN Exposed Pad
Supplier Device Package: 32-HVQFN (7x7)

paquet: 32-VQFN Exposed Pad

Stock5 712

LPC1754FBD80,551

NXP

IC MCU 32BIT 128KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O: 52
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 6x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

paquet: 80-LQFP

Stock4 752

MPC9773FA

NXP

IC CLOCK GEN PLL LV 1:12 52-LQFP

Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
PLL: Yes with Bypass
Input: LVCMOS, LVPECL
Output: LVCMOS
Number of Circuits: 1
Ratio - Input:Output: 3:12
Differential - Input:Output: Yes/No
Frequency - Max: 242.5MHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3.135 V ~ 3.465 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

paquet: 52-LQFP

Stock4 848

TEF6892H/V2,518

NXP

IC RADIO SIGNAL PROC 44-QFP

Function: Audio Tone Processor
Applications: Automotive Audio
Number of Channels: 6
Interface: I2C
Voltage - Supply: 8 V ~ 9 V
Operating Temperature: -40°C ~ 85°C (TA)
Specifications: AM, FM
Package / Case: 44-QFP
Supplier Device Package: 44-PQFP (10x10)

paquet: 44-QFP

Stock5 920

TDA8270AHN/C1,557

NXP

IC TUNER DGTL CBL MODEM 40HVQFN

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: -
Applications: General Purpose
Current - Receiving: -
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

paquet: 40-VFQFN Exposed Pad

Stock5 526

OM7863/BGA3015/RAMP,598

NXP

BOARD OM7863 BGA3015

Type: Amplifier
Frequency: 5MHz ~ 300MHz
For Use With/Related Products: BGA3015
Supplied Contents: Board, Samples

paquet: -

Stock8 208

LS1084ASE7PTA

NXP

LS1084A 1400/1800 ST WE

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock4 176

SP5748GSK0AVKU2R

NXP

TRIPLE CORE, 6M FLASH

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

paquet: 176-LQFP Exposed Pad

Stock4 304

LS1018ASE7PQA

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: 1Gbps (1), 2.5Gbps (5)
SATA: SATA 6Gbps (1)
USB: USB 3.0 (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Secure Boot, TrustZone®
Package / Case: 448-BFBGA
Supplier Device Package: 448-FBGA (17x17)

paquet: -

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FG32K144HAT0MLLR

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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MCIMX537CVP8C2R2

NXP

IC MPU I.MX53 800MHZ 529FBGA

Core Processor: ARM® Cortex®-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Ethernet: 10/100Mbps (1)
SATA: SATA 1.5Gbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 529-FBGA
Supplier Device Package: 529-FBGA (19x19)

paquet: -

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MC33PF8100CCESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

paquet: -

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SAF7770EL-101S130K

NXP

SOFTWARE DEFINED RADIO

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

paquet: -

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FS32K144HAT0VLFR

NXP

S32K144, 512K FLASH, 64K RAM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: -

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S9S12GA64J0MLFR

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: -

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