Produits NXP

PDTC143XK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 4.7k
• Resistor - Emitter Base (R2) (Ohms): 10k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

paquet: TO-236-3, SC-59, SOT-23-3

BZX84-B24/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 24V
• Tolerance: ±2%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 70 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 16.8V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

BAP51-02,315

NXP

DIODE PIN GP 60V 50MA SOD-523

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 60V
• Current - Max: 50mA
• Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
• Resistance @ If, F: -
• Power Dissipation (Max): 715mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

paquet: SC-79, SOD-523

PCA9553TK/02,118

NXP

IC LED DRVR LIN DIM 25MA 8HVSON

• Type: Linear
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 4
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: -
• Current - Output / Channel: 25mA
• Frequency: 400kHz
• Dimming: I2C
• Applications: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

paquet: 8-VFDFN Exposed Pad

TEA1530AT/N2,118

NXP

IC CTRLR SMPS GREEN OVP 8SOIC

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: 650V
• Topology: Flyback
• Voltage - Start Up: 11V
• Voltage - Supply (Vcc/Vdd): 8.7 V ~ 20 V
• Duty Cycle: 70%
• Frequency - Switching: 63kHz
• Power (Watts): 65W
• Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -20°C ~ 145°C (TJ)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO
• Mounting Type: Surface Mount

paquet: 8-SOIC (0.154", 3.90mm Width)

N74F280BD,602

NXP

IC 9-BIT GEN/CHKER 14SO

• Logic Type: Parity Generator/Checker
• Number of Circuits: 9-Bit
• Current - Output High, Low: 1mA, 20mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

paquet: 14-SOIC (0.154", 3.90mm Width)

TDA8542TS/N1,118

NXP

IC AMP AUDIO PWR 1.2W AB 20SSOP

• Type: Class AB
• Output Type: 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 1.2W x 2 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 20-SSOP
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)

paquet: 20-LSSOP (0.173", 4.40mm Width)

TDA8029HL/C207,151

NXP

IC SMART CARD READER 32-LQFP

• Applications: Smart Card
• Interface: Serial
• Voltage - Supply: 2.7 V ~ 6 V
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)
• Mounting Type: Surface Mount

paquet: 32-LQFP

CBTL02043ABQ,115

NXP

IC MUX/DEMUX 2:1 PCI 20DHVQFN

• Applications: DisplayPort, PCIe, USB
• Multiplexer/Demultiplexer Circuit: 2:1
• Switch Circuit: -
• Number of Channels: 2
• On-State Resistance (Max): 6 Ohm (Typ)
• Voltage - Supply, Single (V+): 3 V ~ 3.6 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 10GHz
• Features: Bi-Directional, SATA
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-DHVQFN (4.5x 2.5)

paquet: 20-VFQFN Exposed Pad

MPC8535ECVTANG

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MC8640VU1250HC

NXP

IC MPU MPC86XX 1.25GHZ 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

paquet: 994-BCBGA, FCCBGA

P3041NSE7NNC

NXP

IC MPU Q OR IQ 1.333GHZ 1295BGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

paquet: 1295-BBGA, FCBGA

MPC8275ZQMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

MPC8540VT833LC

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 833MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 784-BBGA, FCBGA

MCIMX6U5DVM10AB

NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

paquet: 624-LFBGA

SPC5643LFF0MLQ1R

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 120MHz
• Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

MC9S12XEG128CALR

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

MC56F8246MLF

NXP

IC MCU 16BIT 48KB FLASH 48LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

MKL04Z32VLC4R

NXP

IC MCU 32BIT 32KB FLASH 32LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 14x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

LPC1112FHN24/202,1

NXP

IC MCU 32BIT 16KB FLASH 24HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 19
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

paquet: 24-VFQFN Exposed Pad

MC9RS08KA4CWGR

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 126 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

LPC1763FBD100,551

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

TDA8763M/3/C5,118

NXP

IC ADC 10BIT HS 28SSOP

• Number of Bits: 10
• Sampling Rate (Per Second): 30M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: Sigma-Delta
• Reference Type: Internal
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP
• Mounting Type: -

paquet: 28-SSOP (0.209", 5.30mm Width)

CX24132-12Z,518

NXP

IC SATELLITE TUNER DGTL 48HVQFN

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: -
• Applications: Satellite Receiver
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

paquet: 48-VFQFN Exposed Pad

USB-KW40Z

NXP

EVAL BOARD USB DONGLE KW40Z

• Type: Transceiver; 802.15.4 (ZigBee?), Bluetooth? Smart 4.x Low Energy (BLE)
• Frequency: 2.4GHz
• For Use With/Related Products: KW20Z, KW30Z, KW40Z
• Supplied Contents: Board

paquet: -

A7001CUHN1/T1AGBEJ

NXP

AU10TICS

• Applications: -
• Core Processor: -
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: -
• Number of I/O: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

S9S08AW32E5MFGER

NXP

8-BIT MCU S08 CORE 32KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

MFS2602AMDA0AD

NXP

AUTO SBC

• Applications: -
• Current - Supply: 30µA
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

paquet: -

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K32L2B11VFT0A

NXP

IC MCU 32BIT 64KB FLASH 48QFN

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 48MHz
• Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
• Peripherals: DMA, LCD, PWM, WDT
• Number of I/O: -
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.2V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 48-UFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

paquet: -

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GTL2014PWZ

NXP

IC TRANSLATOR BIDIR 14TSSOP

• Translator Type: Mixed Signal
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 4
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVTTL
• Output Signal: GTL
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

paquet: -