Produits NXP

PMN25UN,115

NXP

MOSFET N-CH 20V 6A 6TSOP

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 20V
• Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
• Vgs(th) (Max) @ Id: 1V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 470pF @ 10V
• Vgs (Max): ±8V
• FET Feature: -
• Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
• Rds On (Max) @ Id, Vgs: 27 mOhm @ 6A, 4.5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 6-TSOP
• Package / Case: SC-74, SOT-457

paquet: SC-74, SOT-457

BF545C,215

NXP

JFET N-CH 30V 25MA SOT23

• Transistor Type: N-Channel JFET
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: 25mA
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: 30V
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

MC10XS3435DHFK

NXP

IC SWITCH HIGH SIDE QUAD 24PQFN

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 6 V ~ 20 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): 6A
• Rds On (Typ): 10 mOhm (Max), 35 mOhm (Max)
• Input Type: -
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (12x12)

paquet: 24-PowerQFN

GTL2018PW,118

NXP

IC XLATR BI-DIREC 24-TSSOP

• Translator Type: Mixed Signal
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 8
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVTTL
• Output Signal: GTL
• Output Type: Non-Inverted
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

paquet: 24-TSSOP (0.173", 4.40mm Width)

HEC4020BTT,118

NXP

IC COUNTER BIN 14STAGE 16TSSOP

• Logic Type: Binary Counter
• Direction: Up
• Number of Elements: 1
• Number of Bits per Element: 14
• Reset: Asynchronous
• Timing: -
• Count Rate: 35MHz
• Trigger Type: Negative Edge
• Voltage - Supply: 3 V ~ 15 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

paquet: 16-TSSOP (0.173", 4.40mm Width)

UJA1023T/2R04/C;51

NXP

IC CAN/LIN I/O SLAVE 16-SOIC

• Protocol: LIN
• Function: I/O Slave
• Interface: LIN
• Standards: LIN 2.0
• Voltage - Supply: 6.5 V ~ 27 V
• Current - Supply: 45µA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

MPC8245LZU333D

NXP

IC MPU MPC82XX 333MHZ 352TBGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 352-LBGA
• Supplier Device Package: 352-TBGA (35x35)

paquet: 352-LBGA

MPC8377ECVRAJFA

NXP

IC MPU MPC83XX 533MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Security; SEC 3.0
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

MPC850DSLCZQ50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

paquet: 256-BBGA

MC9S08DN32ACLC

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

P87LPC762BDH,512

NXP

IC MCU 8BIT 2KB OTP 20TSSOP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, WDT
• Number of I/O: 18
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

paquet: 20-TSSOP (0.173", 4.40mm Width)

MC908MR8MDWE

NXP

IC MCU 8BIT 8KB FLASH 28SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

paquet: 28-SOIC (0.295", 7.50mm Width)

SPC5676RDK3MVU1

NXP

IC MCU 32BIT 6MB FLASH 416BGA

• Core Processor: e200z7
• Core Size: 32-Bit Dual-Core
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM
• Number of I/O: -
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

paquet: 416-BBGA

MCF54454VR266

NXP

IC MCU 32BIT ROMLESS 360PBGA

• Core Processor: Coldfire V4
• Core Size: 32-Bit
• Speed: 266MHz
• Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, WDT
• Number of I/O: 132
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 360-BBGA
• Supplier Device Package: 360-PBGA (23x23)

paquet: 360-BBGA

MC9S08AW32VFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

paquet: 64-QFP

MM908E625ACEK

NXP

IC HALF-BRIDGE QUAD 54-SOIC

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• RAM Size: 512 x 8
• Interface: SCI, SPI
• Number of I/O: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

PCK210BD,128

NXP

IC CLK BUFFER 1:5 1.5GHZ 32LQFP

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 2
• Ratio - Input:Output: 1:5
• Differential - Input:Output: Yes/Yes
• Input: ECL, PECL
• Output: PECL
• Frequency - Max: 1.5GHz
• Voltage - Supply: 2.25 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

TEA6320T/V1,518

NXP

IC SOUND FADER CONTROL 32SO

• Function: Volume Control
• Applications: Pre-Amplifier
• Number of Channels: 2
• Interface: I2C
• Voltage - Supply: 7.5 V ~ 9.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Specifications: 110dB, 20dB
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SO

paquet: 32-SOIC (0.295", 7.50mm Width)

KTY83/121,113

NXP

IC TEMP SENSOR DO34

• Resistance in Ohms @ 25°C: 990
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 175°C
• Power - Max: -
• Mounting Type: Through Hole
• Package / Case: DO-204AG, DO-34, Axial
• Supplier Device Package: DO-34

paquet: DO-204AG, DO-34, Axial

MMA1220EG

NXP

ACCELEROMETER 8G ANALOG 16SOIC

• Type: Analog
• Axis: Z
• Acceleration Range: ±8g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 250
• Bandwidth: 250Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

13192DSK-A00

NXP

KIT DEV STARTERS FOR MC13191,192

• Type: Transceiver; 802.15.4 (ZigBee?)
• Frequency: 2.4GHz
• For Use With/Related Products: MC13191, MC13192
• Supplied Contents: Board

paquet: -

BGS8M2UKAZ

NXP

IC MMIC AMP LNA WLCSP6

• Frequency: -
• P1dB: -
• Gain: -
• Noise Figure: -
• RF Type: -
• Voltage - Supply: -
• Current - Supply: -
• Test Frequency: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

MC34PF1510A4EPR2

NXP

PF1510

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

paquet: 40-VFQFN Exposed Pad

T1013NSE7MQA

NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

MCIMX6X3EVK10ACR

NXP

I.MX 6SX ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (14x14)

paquet: 400-LFBGA

MIMX8MD6CVAHZAB

NXP

I.MX 8MDUAL 17X17 NO LID 621FBGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: DDR3L, DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
• Ethernet: GbE
• SATA: -
• USB: USB 3.0 (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
• Package / Case: 621-FBGA, FCBGA
• Supplier Device Package: 621-FCPBGA (17x17)

paquet: 621-FBGA, FCBGA

SPC5748GK0AMKU6

NXP

TRIPLE CORE, 6M FLASH

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

paquet: 176-LQFP Exposed Pad

SPC5642AF2MLU2

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 84
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

paquet: 176-LQFP

S9S12G96AMLF

NXP

16BIT 96K FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 3K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

MC908QY8CDWER

NXP

NITRON 8K FLASH 908QY8

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)