Produits NXP

MRFE6VP100HSR5

NXP

FET RF 2CH 133V 512MHZ NI780

• Transistor Type: LDMOS
• Frequency: 512MHz
• Gain: 26dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 100W
• Voltage - Rated: 133V
• Package / Case: NI-780S-4
• Supplier Device Package: NI-780S-4

paquet: NI-780S-4

MRF8P23080HSR3

NXP

FET RF 2CH 65V 2.3GHZ NI780S-4

• Transistor Type: LDMOS (Dual)
• Frequency: 2.3GHz
• Gain: 14.6dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 280mA
• Power - Output: 16W
• Voltage - Rated: 65V
• Package / Case: NI-780S-4
• Supplier Device Package: NI-780S-4

paquet: NI-780S-4

BUK150-50DL,127

NXP

MOSFET N-CH 50V 20A I2PAK

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 20A
• Rds On (Typ): 22 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
• Operating Temperature: 150°C (TJ)
• Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA
• Supplier Device Package: I2PAK

paquet: TO-262-3 Long Leads, I2Pak, TO-262AA

74HCT4515N,652

NXP

IC 4-16 DECOD/DEMUX INV 24DIP

• Type: Decoder/Demultiplexer
• Circuit: 1 x 4:16
• Independent Circuits: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 24-DIP (0.600", 15.24mm)
• Supplier Device Package: 24-DIP

paquet: 24-DIP (0.600", 15.24mm)

MPC8572EVTATLB

NXP

IC MPU MPC85XX 1.2GHZ 1023FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

paquet: 1023-BFBGA, FCBGA

MC7448VU1600PD

NXP

IC MPU MPC74XX 1.6GHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.6GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

paquet: 360-CBGA, FCCBGA

MPC8349ZUAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

paquet: 672-LBGA

MPC8347ECZQAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

paquet: 620-BBGA Exposed Pad

P1023NSN5CFB

NXP

IC MPU Q OR IQ 500MHZ 457TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 500MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 457-LFBGA
• Supplier Device Package: 457-TEPBGA-1 (19x19)

paquet: 457-LFBGA

S912XHY128F0MLL

NXP

IC MCU 16BIT 128KB FLASH 100LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 76
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 8K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

MC68HC11K0CFNE3

NXP

IC MCU 8BIT ROMLESS 84PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.21x29.21)

paquet: 84-LCC (J-Lead)

MCS12KG256MPVE

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

LPC2420FBD208,551

NXP

IC MCU 32BIT ROMLESS 208LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 160
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 82K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

paquet: 208-LQFP

MSC8256TVT800B

NXP

IC PROCESSOR 6-CORE 783FCBGA

• Type: SC3850 Six Core
• Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
• Clock Rate: 800MHz
• Non-Volatile Memory: ROM (96 kB)
• On-Chip RAM: 576kB
• Voltage - I/O: 2.50V
• Voltage - Core: 1.00V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MPC9330AC

NXP

IC PLL CLK GENERATOR 1:6 32-LQFP

• Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
• PLL: Yes with Bypass
• Input: LVCMOS, Crystal
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 2:6
• Differential - Input:Output: No/No
• Frequency - Max: 120MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

PESD12VS2UAT,215

NXP

TVS DIODE 12VWM 35VC SOT23

• Type: Zener
• Unidirectional Channels: 2
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 12V (Max)
• Voltage - Breakdown (Min): 14.7V
• Voltage - Clamping (Max) @ Ipp: 35V
• Current - Peak Pulse (10/1000µs): 5A (8/20µs)
• Power - Peak Pulse: 180W
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: 38pF @ 1MHz
• Operating Temperature: -65°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23 (TO-236AB)

paquet: TO-236-3, SC-59, SOT-23-3

X3G-OH047,005

NXP

IC MAGN FIELD SENSOR DBL DIE

• For Measuring: Angle
• Technology: Magnetoresistive
• Rotation Angle - Electrical, Mechanical: -
• Linear Range: -
• Output: Wheatstone Bridge
• Output Signal: -
• Actuator Type: External Magnet Not Included
• Linearity: -
• Resistance: 3.7 kOhms
• Resistance Tolerance: -
• Voltage - Supply: 5 V ~ 9 V
• Mounting Type: Bare Die
• Termination Style: -
• Operating Temperature: -40°C ~ 150°C

paquet: -

MMA621010EG

NXP

ACCELEROMETER 100G ANALOG 20SOIC

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±100g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 4.68mV/V/g
• Bandwidth: 3kHz
• Output Type: Analog Voltage
• Voltage - Supply: 3.13 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

paquet: 20-SOIC (0.295", 7.50mm Width)

MMA6270Q

NXP

ACCELEROMETER 1.5-6G ANAL 16QFN

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±1.5g, 2g, 4g, 6g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g)
• Bandwidth: 350Hz
• Output Type: Analog Voltage
• Voltage - Supply: 2.2 V ~ 3.6 V
• Features: Selectable Scale
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-LQFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

paquet: 16-LQFN Exposed Pad

TEF6646HW/V101,518

NXP

IC ONE-CHIP RADIO 64HTQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM
• Applications: AM/FM Radio Receiver
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

paquet: 64-TQFP Exposed Pad

JN5169KIT/03Z

NXP

MODULE WIRELESS MCU

• Type: -
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: -

paquet: -

MBC13916T1

NXP

IC RF CASCODE AMP SOT-343R

• Frequency: 100MHz ~ 2.5GHz
• P1dB: 2.5dBm (1.8mW)
• Gain: 19dB
• Noise Figure: -
• RF Type: -
• Voltage - Supply: 2.7 V ~ 5 V
• Current - Supply: 4.7mA
• Test Frequency: 900MHz
• Package / Case: SC-82A, SOT-343
• Supplier Device Package: SOT-343R

paquet: SC-82A, SOT-343

MCIMX286DVM4BR

NXP

I.MX28 32-BIT MPU ARM926EJ-S CO

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 454MHz
• Co-Processors/DSP: Data; DCP
• RAM Controllers: LVDDR, LVDDR2, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD, Touchscreen
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -20°C ~ 70°C (TA)
• Security Features: Boot Security, Cryptography, Hardware ID
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

paquet: 289-LFBGA

SPC5674FAMVY3

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z7
• Core Size: 32-Bit
• Speed: 264MHz
• Connectivity: CANbus, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM
• Number of I/O: 32
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
• Data Converters: A/D 64x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

PTN36043BBXY

NXP

IC

• Type: Buffer, ReDriver
• Applications: USB Type C
• Input: Differential
• Output: Differential
• Data Rate (Max): -
• Number of Channels: 2
• Delay Time: 500ps (Max)
• Signal Conditioning: Input Equalization, Output De-Emphasis
• Capacitance - Input: -
• Voltage - Supply: 1.7V ~ 1.9V
• Current - Supply: 113mA
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 18-XFQFN Exposed Pad
• Supplier Device Package: 18-X2QFN (2.4x2)

paquet: -

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TJA1051TK-3-2Z

NXP

IC TRANSCEIVER HALF 1/1 8HVSON

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 120 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

paquet: -

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LS1018AXN7PQA

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L, DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: USB 3.0 (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

paquet: -

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S32G274AABK0CUCR

NXP

S32G274A ARM CORTEX-M7 AND -A53,

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
• Speed: 400MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L, LPDDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (4)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: -

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MC34PF1550A8EP

NXP

POWER MANAGEMENT IC 3 BUCK REGS

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 4.1V ~ 6V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (5x5)

paquet: -

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MIMX8ML8DVNLZDB

NXP

IC

• Architecture: DSP, MCU, MPU
• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
• Flash Size: -
• RAM Size: 868KB
• Peripherals: DMA, PWM, WDT
• Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
• Speed: 1.8GHz, 800MHz
• Primary Attributes: -
• Operating Temperature: 0°C ~ 95°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

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