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Produits Xilinx Inc.

Dossiers 7 167
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XCZU2CG-2SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock5 088
hot XCV800-5HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP Exposed Pad
Stock22 200
XCV405E-6FG676I
Xilinx Inc.

IC FPGA 404 I/O 676FBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 573440
  • Number of I/O: 404
  • Number of Gates: 129600
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock4 688
XCV2000E-7BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 404
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
paquet: 560-LBGA, Metal
Stock5 328
XC4044XL-3BG432C
Xilinx Inc.

IC FPGA 320 I/O 432MBGA

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 320
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
paquet: 432-LBGA, Metal
Stock3 920
XC7VH870T-L2FLG1932E
Xilinx Inc.

IC FPGA 300 I/O 1932FCBGA

  • Number of LABs/CLBs: 68450
  • Number of Logic Elements/Cells: 876160
  • Total RAM Bits: 51978240
  • Number of I/O: 300
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: 1932-FCBGA (45x45)
paquet: -
Stock7 152
XQ7VX485T-1RF1930M
Xilinx Inc.

IC FPGA VIRTEX-7 485K 1930BGA

  • Number of LABs/CLBs: 37950
  • Number of Logic Elements/Cells: 485760
  • Total RAM Bits: 37969920
  • Number of I/O: 700
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1930-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock2 656
XCVU080-3FFVA2104E
Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

  • Number of LABs/CLBs: 55714
  • Number of Logic Elements/Cells: 975000
  • Total RAM Bits: 51200000
  • Number of I/O: 832
  • Number of Gates: -
  • Voltage - Supply: 0.970 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock4 032
hot XC7VX690T-2FFG1761I
Xilinx Inc.

IC FPGA 850 I/O 1761FCBGA

  • Number of LABs/CLBs: 54150
  • Number of Logic Elements/Cells: 693120
  • Total RAM Bits: 54190080
  • Number of I/O: 850
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1761-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 992
XC6VLX365T-3FF1759C
Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

  • Number of LABs/CLBs: 28440
  • Number of Logic Elements/Cells: 364032
  • Total RAM Bits: 15335424
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock2 240
XC5VLX155-2FF1153I
Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7077888
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1153-BBGA, FCBGA
  • Supplier Device Package: 1153-FCBGA (35x35)
paquet: 1153-BBGA, FCBGA
Stock2 912
XC7K420T-L2FFG901E
Xilinx Inc.

IC FPGA 380 I/O 901FCBGA

  • Number of LABs/CLBs: 32575
  • Number of Logic Elements/Cells: 416960
  • Total RAM Bits: 30781440
  • Number of I/O: 380
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 901-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock5 920
XC6VCX240T-1FFG1156I
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock7 696
XCKU040-1FFVA1156C
Xilinx Inc.

IC FPGA 520 I/O 1156FCBGA

  • Number of LABs/CLBs: 30300
  • Number of Logic Elements/Cells: 530250
  • Total RAM Bits: 21606000
  • Number of I/O: 520
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock4 880
hot XC6VLX195T-2FFG784C
Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

  • Number of LABs/CLBs: 15600
  • Number of Logic Elements/Cells: 199680
  • Total RAM Bits: 12681216
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (29x29)
paquet: 784-BBGA, FCBGA
Stock9 492
XC2VP30-6FGG676I
Xilinx Inc.

IC FPGA 416 I/O 676FBGA

  • Number of LABs/CLBs: 3424
  • Number of Logic Elements/Cells: 30816
  • Total RAM Bits: 2506752
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock6 656
hot XC2VP30-6FFG1152C
Xilinx Inc.

IC FPGA 644 I/O 1152FCBGA

  • Number of LABs/CLBs: 3424
  • Number of Logic Elements/Cells: 30816
  • Total RAM Bits: 2506752
  • Number of I/O: 644
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock6 208
XC7K160T-L2FBG676E
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 12675
  • Number of Logic Elements/Cells: 162240
  • Total RAM Bits: 11980800
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock6 608
XC6SLX75T-2FG676I
Xilinx Inc.

IC FPGA 348 I/O 676FCBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 348
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock4 064
hot XC2S150-5FGG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 176
  • Number of Gates: 150000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock5 248
XA6SLX16-3CSG225I
Xilinx Inc.

IC FPGA 160 I/O 225CSGBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 160
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
paquet: 225-LFBGA, CSPBGA
Stock7 040
XC6SLX16-N3FT256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock6 928
hot XC95216-10BG352C
Xilinx Inc.

IC CPLD 216MC 10NS 352BGA

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 12
  • Number of Macrocells: 216
  • Number of Gates: 4800
  • Number of I/O: 166
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
paquet: 352-LBGA, Metal
Stock14 160
hot XCR3384XL-10TQ144C
Xilinx Inc.

IC CPLD 384MC 9NS 144QFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 24
  • Number of Macrocells: 384
  • Number of Gates: 9000
  • Number of I/O: 118
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock5 568
hot XC95288XL-7FG256I
Xilinx Inc.

IC CPLD 288MC 7.5NS 256PFBGA

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 192
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock13 008
XCVU13P-L2FHGC2104E
Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

  • Number of LABs/CLBs: 216000
  • Number of Logic Elements/Cells: 3780000
  • Total RAM Bits: 514867200
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 110°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (52.5x52.5)
paquet: 2104-BBGA, FCBGA
Stock7 376
XCVU160-2FLGC2104E
Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

  • Number of LABs/CLBs: 115800
  • Number of Logic Elements/Cells: 2026500
  • Total RAM Bits: 130969600
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock7 504
XCDAISY-FFG668
Xilinx Inc.

FFG668 DAISY SAMPLE

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 560