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Produits Xilinx Inc.

Dossiers 7 167
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XC17S200AVQ44I
Xilinx Inc.

IC PROM SER 200000 I-TEMP 44VQFP

  • Programmable Type: OTP
  • Memory Size: 2Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
paquet: 44-TQFP
Stock5 488
XCZU19EG-3FFVE1924E
Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock2 496
XCZU17EG-1FFVE1924I
Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock2 464
XCZU6EG-L2FFVB1156E
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock5 040
XCZU5CG-L1FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock3 280
XCZU4EV-1FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock5 136
XC6SLX100T-N3CSG484I
Xilinx Inc.

IC FPGA 296 I/O 484CSBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
paquet: 484-FBGA, CSPBGA
Stock4 272
hot XCV100E-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 81920
  • Number of I/O: 176
  • Number of Gates: 128236
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock10 224
hot XCS20XL-4VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 77
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock10 380
hot XC4044XL-3BG352I
Xilinx Inc.

IC FPGA 289 I/O 352MBGA

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 289
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
paquet: 352-LBGA, Metal
Stock7 440
hot XC4010XL-3BG256C
Xilinx Inc.

IC FPGA 160 I/O 256BGA

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 160
  • Number of Gates: 10000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
paquet: 256-BBGA
Stock12 240
XC4005XL-09PQ208C
Xilinx Inc.

IC FPGA 112 I/O 208QFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 112
  • Number of Gates: 5000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock7 856
XC6VHX380T-3FFG1155C
Xilinx Inc.

IC FPGA 440 I/O 1156FCBGA

  • Number of LABs/CLBs: 29880
  • Number of Logic Elements/Cells: 382464
  • Total RAM Bits: 28311552
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock3 312
XCKU115-1FLVB2104I
Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

  • Number of LABs/CLBs: 82920
  • Number of Logic Elements/Cells: 1451100
  • Total RAM Bits: 77721600
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock5 680
XCKU085-2FLVB1760I
Xilinx Inc.

IC FPGA 676 I/O 1760FCBGA

  • Number of LABs/CLBs: 62190
  • Number of Logic Elements/Cells: 1088325
  • Total RAM Bits: 58265600
  • Number of I/O: 676
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock4 352
XCKU085-1FLVF1924I
Xilinx Inc.

IC FPGA 624 I/O 1924FCBGA

  • Number of LABs/CLBs: 62190
  • Number of Logic Elements/Cells: 1088325
  • Total RAM Bits: 58265600
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock6 112
hot XC6VSX315T-2FFG1759C
Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

  • Number of LABs/CLBs: 24600
  • Number of Logic Elements/Cells: 314880
  • Total RAM Bits: 25952256
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 336
XC2VP50-7FF1148C
Xilinx Inc.

IC FPGA 812 I/O 1148FCBGA

  • Number of LABs/CLBs: 5904
  • Number of Logic Elements/Cells: 53136
  • Total RAM Bits: 4276224
  • Number of I/O: 812
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
paquet: 1148-BBGA, FCBGA
Stock6 816
hot XC5VLX155-2FFG1760C
Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7077888
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 780
XC5VLX110-3FFG1760C
Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

  • Number of LABs/CLBs: 8640
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 4718592
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 624
XC2VP40-7FF1148C
Xilinx Inc.

IC FPGA 804 I/O 1148FCBGA

  • Number of LABs/CLBs: 4848
  • Number of Logic Elements/Cells: 43632
  • Total RAM Bits: 3538944
  • Number of I/O: 804
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
paquet: 1148-BBGA, FCBGA
Stock6 096
XC6VLX130T-L1FF1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 10000
  • Number of Logic Elements/Cells: 128000
  • Total RAM Bits: 9732096
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock2 144
hot XC4VLX25-11FF668C
Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: 24192
  • Total RAM Bits: 1327104
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 668-BBGA, FCBGA
  • Supplier Device Package: 668-FCBGA (27x27)
paquet: 668-BBGA, FCBGA
Stock6 272
hot XC4VLX15-11FFG676C
Xilinx Inc.

IC FPGA 320 I/O 676FCBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 13824
  • Total RAM Bits: 884736
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock13 908
XC6SLX75-2FG676C
Xilinx Inc.

IC FPGA 408 I/O 676FCBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock2 720
hot XC6SLX16-N3CSG324I
Xilinx Inc.

IC FPGA 232 I/O 324CSBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 232
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock27 432
hot XC3S400-4FGG456C
Xilinx Inc.

IC FPGA 264 I/O 456FBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 294912
  • Number of I/O: 264
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock27 192
hot XC95108-7TQG100C
Xilinx Inc.

IC CPLD 108MC 7.5NS 100TQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 6
  • Number of Macrocells: 108
  • Number of Gates: 2400
  • Number of I/O: 81
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-TQFP (14x14)
paquet: 100-LQFP
Stock5 744
hot XC9572XL-10PC44I
Xilinx Inc.

IC CPLD 72MC 10NS 44PLCC

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 34
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
paquet: 44-LCC (J-Lead)
Stock4 464
XCR3384XL-7PQ208C
Xilinx Inc.

IC CPLD 384MC 7NS 208QFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 24
  • Number of Macrocells: 384
  • Number of Gates: 9000
  • Number of I/O: 172
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock5 184