Les dernières technologies de 3M | Heisener Electronics
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Les dernières technologies de 3M

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Technology Cover

2023-12-04, Evolution of 5G and antenna modules

New 5G use cases and features change the landscape of 5G antenna modules from dedicated, often custom designed and developed portable mobile device hardware used in smartphones and tablets. This translates into integrated iot modules in sensor platforms, autonomous mobile robots (AMR), industrial control devices, augmented reality/virtual reality (AR/VR) headsets/systems, and automotive platforms

Technology Cover

2022-11-29, 3M Mini IDC connectors provide reliability, efficiency and convenience for terminals

3M’s mini-stack connectors provide a reliable connection with a simple termination process while reducing the required board footprint. Their compact size allows for 30% more board space than the 3M mini-clamp connectors.

Technology Cover

2022-10-10, 3M Mini-CLAMP connector provides color encoding and translucent cover with internal lines and fixed functions

3M's Mini-Clamp connectors are designed to provide reliable and cost-effective connectivity for common I/O applications in a variety of sensor control systems, including factory automation and industrial control. These products use advanced IDC technology, which does not require any special tools or preprocessing of cables, and can be terminated using standard pliers

Technology Cover

2022-07-05, 7nm 60 billion transistor Chinese chip, the first domestic

China has developed the first "3D packaging" chip, which means the birth of China's first 7nm chip! The so-called "3D packaged" chip previously referred to TSMC's production technology. According to relevant data, the "3D packaged" chip broke through the 7nm process limit and integrated 60 billion transistors.

Technology Cover

2022-06-19, The smallest mini camera that can be used in medical endoscopy applications

Mouser now stocks NanEyeM miniature camera modules from AMS OSRAM. Camera module is a kind of visual application of micro image sensor, small size is an essential factor. With a footprint of just 1mm², the module's low-voltage differential signal serial interface provides a high SIGNal-to-noise ratio digital output, allowing signals to exceed cable lengths up to 3m.

Technology Cover

2022-06-12, Apple's M2 chip debuts

In the early morning of June 7, Beijing time, Apple held its Worldwide Developers Conference (WWDC), in which Apple announced four major systems, namely iOS 16, Watch OS 9, iPad OS 16, and Mac OS Ventura. As the successor to the first self-developed M1 chip in 2020, Apple has made a number of improvements to the M2 chip to shoulder the responsibility of launching the M2 series of chips.

Technology Cover

2022-01-25, Improve the thermal sensitivity of infrared detector

Lynred's new line of 12 micron products provides optoelectronic systems with a higher level of performance to more accurately identify objects in low-contrast scenes. The company now offers enhanced capabilities across the full range of its 12µm infrared detectors, with applications including integration into outdoor leisure equipment for use at dawn or at night.