Toshiba Electronics Components and Storage announced the introduction of the new high-speed four-channel digital isolator "DCL54xx01" series featuring high common mode transient suppression (CMTI) of 100kV/μs (minimum) and high-speed data rates of 150Mbps.
Microchip Technology ATECC608B Encryption authentication device. The device provides ultra-secure encryption elements that allow for more secure connected systems and is ideal for a variety of iot applications such as home automation, iot node security and ID, industrial networking, messaging security and authentication, medical devices, ecosystem control and anti-cloning.
Alpha and Omega Semiconductor Ltd. has released the 600V aMOS7 Super Junction mosfet series. The device is the company's next generation high voltage MosFeTs designed to meet high efficiency and high density requirements for telecommunication rectifiers, solar inverters, servers, workstations, electric vehicle charging, motor drives and industrial power applications.
Semtech Corporation, a provider of high-performance semiconductors, Internet of Things systems and cloud connectivity services, announced the launch of LoRa Connect LR1121, a new transceiver for Internet of Things endpoints that offers lower power consumption, global connectivity and long-distance communication, extending its market-leading LoRa portfolio.
The Power Communication Committee of the Chinese Society of Electrical Engineering held the "Seminar on Key Technologies of Risk Control of Power Backbone Transmission Network" in Wuhan, Hubei Province, gathering nearly 100 experts and scholars in the power communication industry from all over the country. As a member unit of the Society of Electrical Engineering, Optoelectronic Technology made a special report at the conference, and developed the industry's first highly integrated optoelectronic integrated distributed optical fiber sensing OSM module.
To meet the growing demand for energy efficiency and sustainability in buildings, weather, environmental and industrial measurement equipment manufacturer Vaisala has expanded its heating, ventilation and air conditioning (HVAC) portfolio with the introduction of the new Vaisala GMD110 CO2 transmitter.
The DS4 Intelligent Oxygen sensor from EC Sense is an industrial-grade intelligent gas sensor using reliable printed solid polymer electrochemical sensor technology. Small volume and compact structure design, using high-performance microprocessor, equipped with high precision ADC, as well as intelligent algorithm design, can be easily integrated into the Internet of Things and other monitoring systems, widely used in industrial, commercial, civil and medical fields.
Abracon's supercapacitors use the industry's latest two-layer technology to achieve high energy and high power density. With different combinations of these two characteristics, these ultracapacitors can be used in applications requiring fast charge/discharge or long lasting power output. Abracon supercapacitors can operate in the temperature range as low as -40C where conventional batteries cannot be used.
Infineon Technologies has announced that QDPAK and DDPAK Top Cooled (TSC) packages for its high-voltage MOSFET devices have been successfully registered as JEDEC standard. This move not only further strengthens Infineon's goal to extend the standard package design and shape of the TSC package to a wide range of new designs, but also gives Oems more flexibility and advantage to create differentiated products in the market and raise power density to even higher levels to support a variety of applications.
Infineon Technologies has released a new power module for the car :HybridPACK Drive G2. It builds on its established HybridPACK Drive G1 concept in the integrated B6 package, offering scalability in the same footprint and extending it to higher power and ease of use.
Wurth Elektronik now offers an extensive A-coded M12 circular connector product portfolio (DIN EN 61076-2-101). High quality male and female connectors, screw fit for panel mounting and cable connections, ideal for use in harsh environments of dust, moisture and vibration
Transphorm has announced the launch of six surface mount devices (SMDS) in industry-standard PQFN 5x6 and 8x8 packages. These SMDS offer the reliability and performance benefits of Transphorm's patented SuperGaN® d-mode dual-switched normally closed platform and are packaged in a configuration commonly used by competing e-mode GaN devices. As a result, these six devices can easily be used as a first design source in an e-mode GaN solution, or as a pin-to-pin-compatible plug-and-pull replacement and/or second source.
Infineon Technologies Inc. introduced EZ-PD™ CCG7D, a dual-port USB-C PD (charging) solution that integrates a boost controller for on-board charging applications, meets the latest USB Type-C and PD3.1 specifications and is AEC Q-100 certified. This USB-C PD solution can be used specifically for automotive applications that support Display port, or USB-C Alternate mode.
Infineon has launched SEMPER™ Nano NOR Flash memory. The memory is specially optimized for use in small, battery-powered electronic devices. New wearable and industrial applications such as fitness trackers, smart headsets, health monitors, drones and GPS navigation are emerging, helping to achieve more functions such as accurate tracking, recording critical information, enhancing security and reducing noise
Bel Fuse Inc has expanded its portfolio to include the TET3600-48-104RA. This 3.6kW titanium efficient AC/DC front-end power supply converts up to 277VAC into a main adjustable (42-58VDC) output for powering high-performance datacentre, network, industrial and broadcast applications.
TDK has expanded its Micronas embedded motor controller product portfolio and launched the first members of the new HVC 5x series programmable SoC motor controllers for driving small stepper, BDC, and BLDC motors in automotive and industrial applications. The new series provides a specific application evolution of popular HVC 4x devices, which plan to provide "one IC fits all" motor control solutions for stepper, BLDC, and BDC motors.
ROHM has developed the 4ch/6ch LED driver ICs, BD83A04EFV-M, BD83A14EFV-M, and BD82A26MUF-M, created for medium to large-size displays in-car infotainment and instrument clusters.
XMEMS Labs has announced the full availability of three of its revolutionary MEMS miniature speaker solutions for immediate integration into next-generation true wireless stereo (TWS) headphones, in-ear headphones (IEM), digital hearing AIDS, and emerging personal audio electronics such as smart glasses and sleep earplugs.
