Infineon launched CIPOS Mini IM523 series intelligent power modules to improve the performance and reliability of medium and low power drive applications | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 813
Language Translation

* Please refer to the English Version as our Official Version.

Infineon launched CIPOS Mini IM523 series intelligent power modules to improve the performance and reliability of medium and low power drive applications

Technology Cover
Date de Parution: 2022-11-01, Sensata Technologies/Airpax

   Infineon Technology introduced IM523 series efficient intelligent power module (IPM), further expanding its product lineup of CIPOS Mini family. This series of intelligent power modules adopts the new 600V reverse conductance driver 2 (RCD2) IGBT technology, and has an open emitter. CIPOS IM523 series intelligent power modules integrate multiple power and controller components to improve reliability, optimize PCB size and reduce system costs. They can also be used to control three-phase motors in various low and medium power inverters, such as household appliances, HVAC, and industrial fans and drivers below 1.4KW.

     The combination of RCD2 IGBT and fully functional silicon on insulator (SOI) gate driver can reduce the power loss of the whole system. At the same time, the three-phase inverter configuration with open emitter is integrated into the DIP 36x21 package, which is particularly suitable for power supply applications requiring good heat conduction and electrical isolation. This series of intelligent power modules has lower switching loss among similar products, which can achieve excellent system energy efficiency, especially for high switching frequency applications.

      The rated current range of this series of products is 6A to 17A, and the breakdown voltage is 600V. Built in NTC thermistor with UL certification for temperature monitoring, integrated undervoltage lockout (UVLO) function and over-current protection function (OCP) can further enhance the reliability of the system. The packaging and plastic packaging materials used improve its waterproof and moisture-proof performance. In addition, the intelligent power module simplifies PCB layout through integrated bootstrap circuit. CIPOS IM523 series intelligent power modules adopt industrial standard packaging, which can easily and quickly convert with the existing Mini IPM (P2P) without redesigning the PCB, thus shortening the time to market.

Produits Connexes