Infineon unveils its new i-ToF image sensor to help create a smaller 3D camera system | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 807
Language Translation

* Please refer to the English Version as our Official Version.

Infineon unveils its new i-ToF image sensor to help create a smaller 3D camera system

Technology Cover
Date de Parution: 2023-04-28, Infineon Technologies

Infineon Technologies and Uplander (pmd), a quality partner specializing in 3D ToF, have jointly launched the IRS2877C ToF VGA sensor, a performance advanced version of the IRS2976C Time of Flight (ToF) VGA sensor. The sensor is a new addition to the REAL3™ family of products. The IRS2976C image sensor supports a variety of long range, low power usage scenarios, measuring distances up to or beyond 10 meters. Like all other members of the REAL3™ series, every pixel of this image sensor is powered by Pai 'ander's proprietary Background Lighting suppression (SBI) technology, which enables robust data in high dynamic range (HDR) and daylight scenes.

        

The IRS2976C uses Infineon's new pixel technology to boost the quantum efficiency of pixels to more than 30%, reaching a level that has only been achieved so far with back-illuminated (BSI) sensors, while maintaining the cost advantage of front-illuminated (FSI) sensors. Thanks to this, the IRS2976C image sensor is the world's first ToF image sensor to receive Google Face recognition Level 3 certification (enhanced level), and can operate seamlessly under the display of mobile devices.

The IRS2976C image sensor can support 640 x 480 system VGA resolution. The image sensor is easily compatible with the previous IRS2877C image sensor and can be easily upgraded with its compact size of 23 mm², which is among the world's top. Ultra-high integration allows the sensor to use much less material, smaller shape, and simpler design. The new IRS2976C image sensor works with Infineon's new VCSEL driver, IRS9102C, enabling developers to design smaller, less costly 3D camera systems.

"Our unique ToF CMOS process ensures superior sensitivity and robustness in both indoor and outdoor environments," said Christian Herzum, vice president of Infineon Technologies' 3D Sensing business. In addition, our IRS2976C 3D ToF image sensor has the power and excellent flexibility to optimize 3D camera system design. The sensor is ideal for secure identity authentication in applications such as smartphones, payment terminals and smart door locks, as well as for virtual and augmented reality (AR/VR) headsets, service robots and various Internet of Things devices.

            

Produits Connexes