MOSFETs for Increased Power Density in Modern Automotive Applications | Heisener Electronics
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MOSFETs for Increased Power Density in Modern Automotive Applications

Technology Cover
Date de Parution: 2022-05-28, Diodes Incorporated

     An innovative high current, thermally efficient power pack for electric vehicle applications. The PowerDI8080-5 is now offered by Diodes Incorporated. And this industry-leading performance allows designers of automotive high-power brushless DC motor drives, DC-DC converters and charging systems to maximize system efficiency while ensuring that power dissipation is kept to an absolute minimum. The first product released in this package is the diode DMTH4M70SPGWQ, a 40V automotive MOSFET with a typical RDS(ON) of only 0.54mOhm and a gate charge of 117nC at 10V gate drive .\

    The PCB area of this package is 64mm², which is 40% less PCB area than the TO263 (D2PAK) package format. It also offers a 1.7mm off-board profile, which is 63% lower than TO263. Copper clip connections between die and terminals enable low junction-to-case thermal resistance of 0.36C/W. This allows the package to handle currents up to 460A and yield 8 times greater power density than the TO263 package.

    The package is AEC-Q101 qualified, PPAP capable, and manufactured in an IATF 16949 certified facility. Its gull-wing leads facilitate AOI and improve reliability in temperature cycling.

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