Infineon Technologies AG has launched its SECORA Pay payment solution based on the latest 40nm technology platform.
The plug and play solution draws on extensive expertise in contactless payment technology and uses its SOLID FLASH chip platform to address new payment card and device solutions while meeting the latest needs. Offering components including new applets and custom value-added product standard payment cards (SECORA Payment S), as well as multi-application cards (SECORA Payment X) and off-the-shelf solutions can turn any device into a payment device (SECORA Payment W). At the same time, a global portfolio offers applets (Visa, Mastercard,Discover and American Express) and domestic networks. It delivers state-of-the-art contactless and personalization performance, enabling mastercard contactless transactions in 200 milliseconds.
The series uses security controllers, including authentication software integrated into CoM chip modules and fine-tuning inlays for seamless card production. The CoM system offers the highest flexibility in card design due to the company's use of inductive coupling technology and embedded card antennas. As such, it is well suited to seamlessly respond to future market trends such as eco-friendly cards made from recyclable and Marine plastics or wood, high-performance dual-interface metals or LED cards. These solutions provide backward compatibility with existing SECORA Pay products in terms of card production in antenna design, personalization and product certification
Pre-certified SECORA Pay W with SPA2.1 is a very small antenna on 35mm thin film tape to meet the growing demand for payment accessories and new forms of payment. Turnkey solutions, together with payment and tokenization services provided by partners, can simply integrate payment functionality into end customer applications. It provides a convenient contactless payment function for wristbands, key cards or other forms of wearable devices.
