Page 2 - Produits 3M - Supports pour CI, transistors

248-5205-01

3M

CONN SOCKET QFN 48POS GOLD

Type: QFN
Number of Positions or Pins (Grid): 48 (4 x 12)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES)
Operating Temperature: -

paquet: -

Stock5 076

48 (4 x 12)

0.020" (0.50mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)

-

200-6310-9UN-1900

3M

CONN SOCKET PGA ZIF 100POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 100 (10 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES)
Operating Temperature: -55°C ~ 150°C

paquet: -

Stock6 684

100 (10 x 10)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polyethersulfone (PES)

-55°C ~ 150°C

224-1286-00-0602J

3M

CONN IC DIP SOCKET ZIF 24POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

paquet: -

Stock6 072

24 (2 x 12)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

242-1281-00-0602J

3M

CONN IC DIP SOCKET ZIF 42POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

paquet: -

Stock8 004

42 (2 x 21)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

218-3341-00-0602J

3M

CONN IC DIP SOCKET ZIF 18POS GLD

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

paquet: -

Stock7 488

18 (2 x 9)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

268-5401-00-1102JH

3M

CONN SOCKET CLCC 68POS GOLD

Type: CLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -55°C ~ 105°C

paquet: -

Stock8 802

68 (4 x 17)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-55°C ~ 105°C

216-6278-00-3303

3M

CONN IC DIP SOCKET ZIF 16POS GLD

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 250µin (6.35µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 250µin (6.35µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyether Imide (PEI), Glass Filled
Operating Temperature: -55°C ~ 105°C

paquet: -

Stock6 312

16 (2 x 8)

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Polyether Imide (PEI), Glass Filled

-55°C ~ 105°C

8468-11B1-RK-TP

3M

CONN SOCKET PLCC 68POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock13 704

68 (4 x 17)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8468-21B1-RK-TP

3M

CONN SOCKET PLCC 68POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock13 632

68 (4 x 17)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8468-21A1-RK-TP

3M

CONN SOCKET PLCC 68POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock16 626

68 (4 x 17)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8452-11B1-RK-TP

3M

CONN SOCKET PLCC 52POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock26 634

52 (4 x 13)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8444-21A1-RK-TP

3M

CONN SOCKET PLCC 44POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 44 (4 x 11)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock18 558

44 (4 x 11)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8432-21B1-RK-TP

3M

CONN SOCKET PLCC 32POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock22 446

32 (2 x 7, 2 x 9)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8428-11B1-RK-TP

3M

CONN SOCKET PLCC 28POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock16 626

28 (4 x 7)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8428-21B1-RK-TP

3M

CONN SOCKET PLCC 28POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock15 294

28 (4 x 7)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8432-11B1-RK-TP

3M

CONN SOCKET PLCC 32POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock22 146

32 (2 x 7, 2 x 9)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8420-21B1-RK-TP

3M

CONN SOCKET PLCC 20POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 20 (4 x 5)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock18 102

20 (4 x 5)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8420-11B1-RK-TP

3M

CONN SOCKET PLCC 20POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 20 (4 x 5)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock12 486

20 (4 x 5)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8428-21B1-RK-TR

3M

CONN SOCKET PLCC 28POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock15 504

28 (4 x 7)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

4840-6004-CP

3M

CONN IC DIP SOCKET 40POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock21 156

40 (2 x 20)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4840-6000-CP

3M

CONN IC DIP SOCKET 40POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock22 626

40 (2 x 20)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4828-6004-CP

3M

CONN IC DIP SOCKET 28POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock48 360

28 (2 x 14)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4824-6000-CP

3M

CONN IC DIP SOCKET 24POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock23 952

24 (2 x 12)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4824-3000-CP

3M

CONN IC DIP SOCKET 24POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock75 738

24 (2 x 12)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4828-6000-CP

3M

CONN IC DIP SOCKET 28POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock13 770

28 (2 x 14)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4832-6000-CP

3M

CONN IC DIP SOCKET 32POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock18 102

32 (2 x 16)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4820-3004-CP

3M

CONN IC DIP SOCKET 20POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock18 792

20 (2 x 10)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4820-3000-CP

3M

CONN IC DIP SOCKET 20POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock27 666

20 (2 x 10)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4816-3004-CP

3M

CONN IC DIP SOCKET 16POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock22 320

16 (2 x 8)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4818-3000-CP

3M

CONN IC DIP SOCKET 18POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

paquet: -

Stock31 470

18 (2 x 9)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C