Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M |
CONN IC DIP SOCKET 8POS TIN
|
paquet: - |
Stock4 140 |
|
8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyester, Glass Filled | -65°C ~ 105°C |
||
3M |
CONN SOCKET CLCC 68POS GOLD
|
paquet: - |
Stock5 364 |
|
68 (4 x 17) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 105°C |
||
3M |
CONN SOCKET CLCC 68POS GOLD
|
paquet: - |
Stock7 830 |
|
68 (4 x 17) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 105°C |
||
3M |
CONN SOCKET CLCC 68POS GOLD
|
paquet: - |
Stock7 200 |
|
68 (4 x 17) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 105°C |
||
3M |
CONN SOCKET PQFP 100POS TIN-LEAD
|
paquet: - |
Stock6 462 |
|
100 (4 x 25) | - | Tin-Lead | 200µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | - | Tin-Lead | 200µin (5.08µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | 0°C ~ 105°C |
||
3M |
CONN IC DIP SOCKET ZIF 40POS GLD
|
paquet: - |
Stock6 192 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 250µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
||
3M |
CONN IC DIP SOCKET ZIF 20POS GLD
|
paquet: - |
Stock2 520 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 250µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
||
3M |
CONN SOCKET QFN 60POS GOLD
|
paquet: - |
Stock3 276 |
|
60 (4 x 15) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
||
3M |
CONN ZIG-ZAG ZIF 51POS GOLD
|
paquet: - |
Stock5 022 |
|
51 (1 x 25, 1 x 26) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 51POS GOLD
|
paquet: - |
Stock5 904 |
|
51 (1 x 25, 1 x 26) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 35POS GOLD
|
paquet: - |
Stock3 276 |
|
35 (1 x 17, 1 x 18) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 35POS GOLD
|
paquet: - |
Stock5 778 |
|
35 (1 x 17, 1 x 18) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 35POS GOLD
|
paquet: - |
Stock4 680 |
|
35 (1 x 17, 1 x 18) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 35POS GOLD
|
paquet: - |
Stock5 004 |
|
35 (1 x 17, 1 x 18) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 34POS GOLD
|
paquet: - |
Stock2 898 |
|
34 (2 x 17) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 34POS GOLD
|
paquet: - |
Stock6 228 |
|
34 (1 x 34) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 34POS GOLD
|
paquet: - |
Stock7 254 |
|
34 (2 x 17) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN ZIG-ZAG ZIF 34POS GOLD
|
paquet: - |
Stock2 988 |
|
34 (2 x 17) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
SOCKET ZIP IN-LINE 36POS
|
paquet: - |
Stock5 778 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
3M |
CONN ZIG-ZAG 39POS GOLD
|
paquet: - |
Stock3 472 |
|
39 (1 x 19, 1 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 150°C |
||
3M |
IN-LINE ZIP STRIP POCKETS 32 CON
|
paquet: - |
Stock4 680 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
3M |
CONN ZIG-ZAG 39POS GOLD
|
paquet: - |
Stock3 960 |
|
39 (1 x 19, 1 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 150°C |
||
3M |
CONN SOCKET 39POS ZIP STRIP
|
paquet: - |
Stock3 526 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
3M |
STAGGERED ZIP STRIP POCKETS 32 C
|
paquet: - |
Stock3 042 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
3M |
STAGGERED ZIP STRIP POCKETS 32 C
|
paquet: - |
Stock4 230 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
3M |
CONN SOCKET PGA ZIF 32POS GOLD
|
paquet: - |
Stock3 472 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN SOCKET PGA ZIF 32POS GOLD
|
paquet: - |
Stock8 046 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN SOCKET 39POS ZIP STRIP
|
paquet: - |
Stock6 876 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
3M |
CONN SOCKET PLCC 84POS GOLD
|
paquet: - |
Stock8 406 |
|
84 (4 x 21) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 105°C |
||
3M |
CONN IC DIP SOCKET ZIF 32POS GLD
|
paquet: - |
Stock5 580 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 250µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |