Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC TDM SWITCH 4K-CH ENH 256BGA
|
paquet: 256-BGA |
Stock2 576 |
|
- | 1 | 1.71 V ~ 1.89 V | 175mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC SLAC NGCC OCTAL 196BGA
|
paquet: - |
Stock7 136 |
|
- | 1 | - | - | - | - | Surface Mount | - | 196-BGA |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
paquet: - |
Stock2 288 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Cirrus Logic Inc. |
IC LIU T1/E1 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock5 040 |
|
E1, T1 | 1 | 4.75 V ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Maxim Integrated |
IC OCTAL FRAMER T1/E1/J1 256BGA
|
paquet: 256-LBGA, CSBGA |
Stock5 520 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC TRANSCEIVER T1 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock4 080 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
NXP |
IC TRANSMISSION LV 16-SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock2 448 |
|
- | 1 | 3.4V | 900µA | 454mW | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SO |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock6 768 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Silicon Labs |
IC LINEFEED INTRFC SI321X 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Stock362 844 |
|
PCM, Serial, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 800mW | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Maxim Integrated |
IC LIU QUAD E1/T1/J1 144-BGA
|
paquet: 144-BGA |
Stock4 528 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA | 144-TEPBGA (17x17) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock2 944 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
STMicroelectronics |
IC PCM TONE CIRCUIT 24-DIP
|
paquet: 24-DIP (0.600", 15.24mm) |
Stock12 888 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 50mA | 500mW | 0°C ~ 70°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-DIP |
||
NXP |
IC C2K 900MHZ 8CH VOIP 625FCBGA
|
paquet: - |
Stock5 072 |
|
- | - | - | - | - | - | - | - | - |
||
Exar Corporation |
IC LIU/FRAMER T1/E1/J1 4CH 225BG
|
paquet: 225-BGA |
Stock4 992 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Microsemi Corporation |
IC VOICE LINE VCP 32CH 128TQFP
|
paquet: - |
Stock5 456 |
|
2-Wire | 32 | 3.3V | - | - | - | Surface Mount | - | 128-TQFP |
||
STMicroelectronics |
IC OFDM PWR SOC IND/ASIC 100TQFP
|
paquet: 100-TQFP Exposed Pad |
Stock6 496 |
|
I2C, SPI | 1 | 8 V ~ 18 V | - | - | -40°C ~ 80°C | Surface Mount | 100-TQFP Exposed Pad | 100-TQFP (14x14) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock2 208 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC FXO GLOBAL 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock2 928 |
|
- | 1 | 3.13 V ~ 3.47 V | 25mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 100V 48QFN
|
paquet: - |
Stock6 112 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-QFN |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock7 312 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Silicon Labs |
IC PROSLIC FXS ISI -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock5 808 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock5 184 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 100V 48QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock3 280 |
|
4-Wire | 1 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 150V 48QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock4 384 |
|
4-Wire | 1 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
2P, DUAL-MEDIA, GE PHY, MACSEC 2
|
paquet: - |
Stock4 768 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 64TQFP
|
paquet: - |
Stock4 576 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 64-eTQFP |
||
Microchip Technology |
IC SOLAC FXS+FXO 1CH 48LQFP
|
paquet: - |
Stock2 064 |
|
4-Wire Serial | 2 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC TXRX SGL T1/E1 68PLCC
|
paquet: 68-LCC (J-Lead) |
Stock7 072 |
|
- | 1 | 4.75V ~ 5.25V | 200mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock7 008 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC LINE DRIVER CLASS AB 28QFN
|
paquet: - |
Stock6 160 |
|
- | 2 | - | - | - | - | Surface Mount | - | 28-QFN |