Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CONTROLLER PCM 44LCC
|
paquet: 44-LCC (J-Lead) |
Stock5 072 |
|
ISDN, PCM | 1 | 5V | 9.5mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | P-LCC-44 |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
paquet: 80-LQFP |
Stock6 288 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Maxim Integrated |
IC TXRX DS3/E3 100CSBGA
|
paquet: 100-LBGA, CSBGA |
Stock6 896 |
|
DS3, E3 | 1 | 3.135 V ~ 3.465 V | 120mA | - | 0°C ~ 70°C | Surface Mount | 100-LBGA, CSBGA | 100-CSBGA (11x11) |
||
Exar Corporation |
IC FSK DEMOD/TONE DECOD 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock2 640 |
|
- | - | 4.5 V ~ 20 V | 5mA | 900mW | 0°C ~ 70°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Inphi Corporation |
IC ETH AGGREGATOR 4P 1024-BGA
|
paquet: 1024-BGA |
Stock5 600 |
|
Interlaken, XAUI | - | - | - | - | - | Surface Mount | 1024-BGA | 1024-BGA (33x33) |
||
Exar Corporation |
IC FRAMER DS3/E3 2CH 160QFP
|
paquet: 160-BQFP |
Stock6 944 |
|
- | - | 3.3V | 100mA | - | -40°C ~ 85°C | Surface Mount | 160-BQFP | 160-PQFP (28x28) |
||
Exar Corporation |
IC LIU EI SGL 28SOJ
|
paquet: 28-BSOJ (0.300", 7.62mm Width) |
Stock3 712 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Maxim Integrated |
IC FRAMER DUAL T1 LIU 100-LQFP
|
paquet: 100-LQFP |
Stock3 952 |
|
Parallel/Serial | 2 | 3.135 V ~ 3.465 V | 85mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC FRAMER 4X4 16CH 300-BGA
|
paquet: 300-BBGA |
Stock7 568 |
|
Parallel/Serial | - | 2.97 V ~ 3.63 V | 225mA | - | 0°C ~ 70°C | Surface Mount | 300-BBGA | 300-PBGA (27x27) |
||
Maxim Integrated |
IC TXRX T1 1-CH 5V LP IND 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock6 672 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 65mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Exar Corporation |
IC LIU/FRAMER 8CHAN 329BGA
|
paquet: - |
Stock5 008 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock10 140 |
|
- | 1 | 3 V ~ 3.6 V | 4mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Microsemi Corporation |
IC SLIC 1CH 40DB LGBAL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock6 368 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -106V 36QFN
|
paquet: - |
Stock6 784 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Silicon Labs |
IC SLIC/CODEC PROG 38TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock4 128 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-DFN
|
paquet: 28-VDFN Exposed Pad |
Stock3 680 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
Silicon Labs |
IC PROSLIC FXS PCM DTMF 56QFN
|
paquet: - |
Stock5 584 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC PHONE LINE INTERFACE 32SOIC
|
paquet: 32-SOIC (0.295", 7.50mm Width) |
Stock77 520 |
|
- | 1 | 3 V ~ 5.5 V | 9mA | 1W | -40°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Silicon Labs |
IC PROSLIC DUAL FXS ANLG 48-QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock38 640 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Corporation |
IC SUBSCRIBER NETWRK DNIC 28PLCC
|
paquet: - |
Stock17 244 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
||
Broadcom Limited |
INTEGRATED GBE CONTROLLER
|
paquet: - |
Stock2 752 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SLIC RINGING LP HOME 28-PLCC
|
paquet: 28-LCC (J-Lead) |
Stock6 128 |
|
- | 1 | 5V | 5mA | 305mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
XDSL CPE LINE DRIVER
|
paquet: - |
Stock5 856 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock5 744 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC HDLC PROTOCOL CTLR 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock2 624 |
|
- | 1 | 4.75V ~ 5.25V | 1µA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256LQFP
|
paquet: 256-LQFP |
Stock7 376 |
|
- | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
IC SLIC 2CH RINGING MTRG 44TQFP
|
paquet: 44-TQFP |
Stock2 720 |
|
2-Wire | 1 | - | - | - | - | Surface Mount | 44-TQFP | 44-TQFP |
||
Microchip Technology |
IC CODEC/FILTER 4CH 20IO 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock3 632 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.58x16.58) |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 48QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock6 288 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
17PRT UNMAN L2 SW W/12 INT CU PH
|
paquet: 672-BGA |
Stock7 056 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |