Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SLIC-DC W/DC-DC CONV PDSO-24
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock3 664 |
|
- | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | P-DSO-24 |
||
Infineon Technologies |
IC SHDSL TRANSCEIVER BGA-484
|
paquet: 484-BBGA |
Stock4 464 |
|
DSL, SHDSL, TDM | 1 | - | - | 500mW | -40°C ~ 85°C | Surface Mount | 484-BBGA | 484-BGA |
||
Microsemi Corporation |
IC FRAMER/INTERFACE CEPT 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock6 480 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 8mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
paquet: 144-BGA, CSPBGA |
Stock6 492 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 300mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
paquet: 144-BGA, CSPBGA |
Stock5 152 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC ELASTIC STORE MEMORY 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock6 896 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Texas Instruments |
IC RES RING GEN CTRLR 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock7 376 |
|
- | 1 | 12V | 500µA | - | -40°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
paquet: 64-TQFP |
Stock28 704 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock5 056 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC RECEIVER DTMF CMOS LP 18-DIP
|
paquet: 18-DIP (0.300", 7.62mm) |
Stock94 200 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | 35mW | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-DIP |
||
IXYS Integrated Circuits Division |
IC RECEIVER DTMF CMOS LP 18-DIP
|
paquet: 18-DIP (0.300", 7.62mm) |
Stock40 272 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | 35mW | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-DIP |
||
Maxim Integrated |
IC TRANSCEIVER T1 IND 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock2 100 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 16K CH 256BGA
|
paquet: 256-BGA |
Stock4 960 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC TDM SWITCH 1024X1024 256LQFP
|
paquet: 256-LQFP |
Stock5 296 |
|
- | 1 | 1.71 V ~ 1.89 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 SGL SHORT HAUL 44-TQFP
|
paquet: 44-LQFP |
Stock2 176 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 28I/O 64LQFP
|
paquet: 64-LQFP |
Stock379 188 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (14x14) |
||
Silicon Labs |
IC PROSLIC FXS ISI -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock7 696 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 150V 48TQFP
|
paquet: - |
Stock256 488 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-eTQFP |
||
IXYS Integrated Circuits Division |
DAA LITELINK III RING DETECT
|
paquet: - |
Stock5 968 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC ABS VOICEPORT 2CH FXS 64QFN
|
paquet: 64-VFQFN Exposed Pad |
Stock4 144 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SMD
|
paquet: 8-SMD, Gull Wing |
Stock5 904 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
Microsemi Corporation |
IC CNIC CIDCW CID 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock12 240 |
|
4-Wire | 1 | 2.7 V ~ 5.5 V | 2.8mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microsemi Solutions Sdn Bhd. |
DUAL 10/100/1000 BASE-T & 100/10
|
paquet: - |
Stock6 400 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 28-PLCC
|
paquet: 28-LCC (J-Lead) |
Stock22 212 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
32 CHANNEL SHORT HAUL T1/E1 LIU
|
paquet: - |
Stock3 344 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DIGITAL SWITCH 32K CH 324BGA
|
paquet: 324-BGA |
Stock6 016 |
|
- | 1 | 1.71V ~ 1.89V | 500mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (19x19) |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 535BGA
|
paquet: 535-BGA |
Stock5 184 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 535-BGA | 535-PBGA (31x31) |
||
Microchip Technology |
IC TDM/TSI SWITCH 512X256 44MQFP
|
paquet: 44-QFP |
Stock3 312 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Microchip Technology |
IC SLIC 1CH 8KHZ 100V 16SOIC
|
paquet: - |
Stock4 928 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
||
Microchip Technology |
17PRT UNMAN L2 SW W/12 INT CU PH
|
paquet: 672-BGA |
Stock8 172 |
|
Serial | 1 | 1V | - | - | 0°C ~ 125°C | Surface Mount | 672-BGA | 672-HSBGA (27x27) |