Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SOLAC FXS+FXO 1CH HV 48LQFP
|
paquet: - |
Stock12 612 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock4 048 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Exar Corporation |
IC LIU/FRAMER DS3/E3 1CH 208BGA
|
paquet: 208-LBGA |
Stock4 112 |
|
LIU | - | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-STBGA (17x17) |
||
Maxim Integrated |
IC LIU SDH SONET 2CH 128-LQFP
|
paquet: 128-LQFP Exposed Pad |
Stock4 816 |
|
CMOS | 2 | 3.15 V ~ 3.45 V | 325mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP Exposed Pad | 128-LQFP (14x14) |
||
Maxim Integrated |
IC PLC MODEM OFDM BASED 64-LQFP
|
paquet: 64-LQFP |
Stock12 900 |
|
I2C, SPI, UART | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 1CH 44-TQFP
|
paquet: 44-LQFP |
Stock4 464 |
|
- | - | 3.13 V ~ 3.47 V | - | - | - | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
STMicroelectronics |
IC RINGER ELECTR 2TONE 8-MINIDIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 656 |
|
- | 1 | 26V | 30mA | - | -40°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-Mini DIP |
||
Silicon Labs |
IC SYSTEM-SIDE DAA 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock457 464 |
|
DSP, Serial | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Texas Instruments |
IC ADAPTER DIG QDASL QUAD 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock6 640 |
|
ISDN | 1 | - | 20mA | - | - | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
paquet: 128-LQFP Exposed Pad |
Stock16 500 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 480mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP Exposed Pad | 128-LQFP (14x20) |
||
Microsemi Corporation |
IC SLAC 4CH 3V GCI/PCM 64TQFP
|
paquet: 64-TQFP |
Stock39 408 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Texas Instruments |
IC SOURCE RINGER CTRLR 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock13 116 |
|
- | 1 | 5V | 500µA | - | 0°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
paquet: - |
Stock7 488 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC SLIC LINE SUBSCRIBER 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock15 276 |
|
- | 1 | 3.13 V ~ 3.47 V | 25mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock69 864 |
|
- | 2 | 1.2V | 50mA | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC RECEIVER DTMF 18DIP
|
paquet: 18-DIP (0.300", 7.62mm) |
Stock193 200 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microsemi Solutions Sdn Bhd. |
10 PORT UNMANAGED SWITCH
|
paquet: - |
Stock7 740 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
||
Microsemi Corporation |
IC VOICE ECHO CANCELLER 100LQFP
|
paquet: 100-LQFP |
Stock5 424 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC LIU QUAD T1/E1/J1 256-BGA
|
paquet: 256-BGA |
Stock4 352 |
|
LIU | 4 | 3.135 V ~ 3.465 V | - | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Broadcom Limited |
SWITCH FABRIC
|
paquet: - |
Stock7 328 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
SINGLE-CHIP SONET/SDH TRANSPORT
|
paquet: - |
Stock3 424 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock5 616 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 44MQFP
|
paquet: 44-QFP |
Stock7 712 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Microchip Technology |
IC SLIC 2CH RINGING MTRG 44TQFP
|
paquet: 44-TQFP |
Stock5 968 |
|
2-Wire | 1 | - | - | - | - | Surface Mount | 44-TQFP | 44-TQFP |
||
Microchip Technology |
IC LINE CARD LCAS 1CH 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock4 576 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 ENABLED
|
paquet: - |
Stock7 104 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TELECOM INTERFACE ICS 32 LINK
|
paquet: - |
Stock3 152 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH ISO-CMOS 40DIP
|
paquet: 40-DIP (0.620", 15.75mm) |
Stock3 728 |
|
- | 1 | 4.75V ~ 5.25V | 6mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.620", 15.75mm) | 40-PDIP |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 48TQFP
|
paquet: - |
Stock6 112 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-eTQFP |
||
Microchip Technology |
4CH SLAC 3V 20 I/0 PQT44 T&R
|
paquet: - |
Stock13 308 |
|
- | - | - | - | - | - | - | - | - |