Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intersil |
IC LINE DVR DIFF 300MHZ 16QFN
|
paquet: - |
Stock4 848 |
|
- | 1 | 4.5 V ~ 13.2 V | 6mA | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 145V 64TQFP
|
paquet: - |
Stock3 984 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microsemi Corporation |
IC SLIC 1CH 8KHZ 150V HV 16SOIC
|
paquet: - |
Stock60 828 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
||
Microsemi Corporation |
IC SOLAC FXS+FXO 1CH HV 48LQFP
|
paquet: - |
Stock3 712 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microsemi Corporation |
IC DIGITAL SWITCH 32K CH 484BGA
|
paquet: 484-BGA |
Stock7 488 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Microsemi Corporation |
IC FRAMER OCT T1/E1/J1 220BGA
|
paquet: 220-LBGA |
Stock3 744 |
|
- | 1 | 3 V ~ 3.6 V | 30mA | - | -40°C ~ 85°C | Surface Mount | 220-LBGA | 220-LBGA (17x17) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 512X256 48SSOP
|
paquet: 48-BSSOP (0.295", 7.50mm Width) |
Stock4 640 |
|
- | 1 | 3 V ~ 3.6 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Silicon Labs |
IC SLIC PROG 1CH 38QFN
|
paquet: 38-VFQFN Exposed Pad |
Stock2 416 |
|
SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock13 452 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
paquet: 144-BGA, CSPBGA |
Stock4 976 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
paquet: 217-BBGA |
Stock3 088 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Silicon Labs |
IC LINE-SIDE DAA 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock6 384 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
paquet: 16-VDFN Exposed Pad |
Stock3 552 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock4 176 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Maxim Integrated |
IC TXRX E1 QUAD 256BGA
|
paquet: 256-BGA |
Stock4 304 |
|
E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Microsemi Corporation |
IC TIMING-OVER-PACKET 324BGA
|
paquet: 324-BGA |
Stock3 008 |
|
- | 1 | 3 V ~ 3.6 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 120LQFP
|
paquet: 120-LQFP |
Stock6 480 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 350mA | - | -40°C ~ 85°C | Surface Mount | 120-LQFP | 120-LQFP (14x20) |
||
Exar Corporation |
IC LIU T1/E1 SGL 28SOJ
|
paquet: 28-BSOJ (0.300", 7.62mm Width) |
Stock5 504 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Microsemi Corporation |
IC HDLC PROTOCOL CTLR 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock9 120 |
|
- | 1 | 4.75 V ~ 5.25 V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
paquet: - |
Stock4 336 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS 1CH -136V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock2 592 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock243 972 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock5 472 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC/CODEC DTMF 38VQFN
|
paquet: 38-VFQFN Exposed Pad |
Stock2 864 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Microsemi Corporation |
IC TXRX SGL E1 W/LIU 68PLCC
|
paquet: 68-LCC (J-Lead) |
Stock17 940 |
|
- | 1 | 4.75 V ~ 5.25 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) |
||
Microsemi Corporation |
IC ECHO CANCELLER DUAL 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock7 504 |
|
Serial | 2 | 4.5 V ~ 5.5 V | 50mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Silicon Labs |
IC LINE-SIDE DAA 20QFN
|
paquet: 20-VFQFN Exposed Pad |
Stock14 460 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (3x3) |
||
Microchip Technology |
IC LINE CARD LCAS 1CH 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock7 040 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock2 448 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
IC LINE DRIVER CLASS AB 16QFN
|
paquet: - |
Stock5 920 |
|
- | 1 | - | - | - | - | Surface Mount | - | 16-QFN |