Les dernières technologies de Quarton Inc. | Heisener Electronics
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Les dernières technologies de Quarton Inc.

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Technology Cover

2022-07-29, Fibocom Wireless releases AI smart module SCA825-W, powerful computing power helps AIoT applications unleash unlimited potential

Fibocom Wireless has officially launched the high computing power AI module SCA825-W based on the Qualcomm QCS8250 chip platform, which will be fully applied to the AIoT field of complex video image analysis such as networked medical care, digital signage, smart retail, and video collaboration. Guanghetong AI module enriches the intelligent module product line, AI performance generates strong potential energy, and has accumulated a lot in the field of digital economy applications.

Technology Cover

2022-06-26, e-con partners with Qualcomm to launch embedded AI vision development kit

The new qSmartAI80_CUQ610 AI Vision Kit from e-con Systems in partnership with Qualcomm provides a complete AI vision and analytics solution for a wide range of vision applications. This vision kit uses a Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module to provide superior visual quality. The kit can process images locally without connecting to any cloud server. Additionally, it is capable of running ML/DL models for visual data. Therefore, this kit is the perfect and reliable solution for various AI vision applications.

Technology Cover

2022-02-27, The wi-Fi-6 front-end module is optimized for THE IEEE 802.11ax system

Qvo QPF4532 5.0ghz wi-Fi-6 front end module (FEM) is optimized for IEEE 802.11ax systems. The QPF4532 has a frequency range of 5150MHz to 5850MHz, up to 31dB transmission gain, and a low 2dB noise figure. At 3.3V supply voltage, the performance of the finite element method is focused on optimizing PA. This feature saves power consumption while maintaining high linear output power and leading-edge throughput